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PCA9539PWRE4

Texas Instruments

PCA9539PWRE4 by Texas Instruments

PCA9539PWRE4 by Texas Instruments is a 16-bit parallel I/O port with supply voltage of 2.3-5.5V, operating temperature range of -40 to 85°C. It features small outline package style and is ideal for industrial applications requiring general purpose parallel I/O ports.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,857 parts In-Stock

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Digiode

USA . 2,694 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 483 parts In-Stock

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$13.942

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483

$13.942

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Semicontronic

India . 261 parts In-Stock

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$14.000

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$13.650

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$13.580

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261

$14.000

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$13.580

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One Stop Electronics

USA . 635 parts In-Stock

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$18.000

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635

$18.000

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$29.689

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$28.204

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$28.204

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$29.689

$28.204

$28.204

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Ampacity Inc.

Singapore . 1,117 parts In-Stock

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$34.000

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$34.000

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Corohmni

South Africa . 147 parts In-Stock

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$42.476

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Parana Technologies

USA . 1,973 parts In-Stock

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$71.661

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$71.661

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DigiPath Technology Company

USA . 914 parts In-Stock

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$78.908

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$72.595

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914

$78.908

$72.595

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ChromeModa Solutions

Germany . 3,866 parts In-Stock

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$80.518

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$66.025

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$80.518

$66.025

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IDEA Electronic Components Group

UK . 1,075 parts In-Stock

1+ parts

$80.518

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$76.492

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$72.466

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$80.518

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Microchip USA

USA . 4,442 parts In-Stock

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Argo Parts USA

USA . 4,216 parts In-Stock

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Corphita

USA . 3,238 parts In-Stock

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Continental Prestige Electronics

USA . 1,901 parts In-Stock

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Bastille Electronics

Australia . 31 parts In-Stock

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Overview

Upgrade your parallel I/O ports with the PCA9539PWRE4 by Texas Instruments. Crafted with precision using high-quality materials, this versatile device offers a wide range of applications in various industries. Experience seamless integration and enhanced performance with its cutting-edge technology and reliable design. Trust Texas Instruments to deliver top-notch products that exceed expectations. Elevate your projects with the PCA9539PWRE4 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the product, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options, making the product compatible with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on circuit boards, making it suitable for compact electronic devices.

No. of Bits: 16

With 16 bits, this product offers sufficient parallel I/O ports for connecting multiple devices or peripherals, making it versatile for various applications.

Power Supplies (V): 2.5/5

The availability of dual power supply options (2.5V and 5V) allows for compatibility with different voltage requirements, enhancing the product's flexibility.

No. of Terminals: 24

Having 24 terminals provides ample connection points for integrating the product into complex electronic systems, enhancing connectivity and functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design of the package contribute to space-saving on circuit boards, ideal for compact electronic designs.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage ensures efficient power consumption and is suitable for devices operating on lower power sources, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand elevated temperatures, making it reliable for use in industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures the product's reliability in extreme cold conditions, suitable for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides corrosion resistance and ensures reliable electrical connections, increasing the product's longevity and performance.

Terminal Position: DUAL

Dual terminal positions offer flexibility in installation and connection options, enabling versatile usage scenarios for the product.

No. of Ports: 2

With 2 ports, the product can accommodate multiple external devices or peripherals simultaneously, allowing for efficient data transfer and communication.

Maximum Seated Height: 1.2 mm

The low seated height of 1.2 mm makes the product suitable for slim and compact electronic designs, offering versatility in space-constrained applications.

Width: 4.4 mm

The compact width of 4.4 mm contributes to the product's space-saving design, ideal for integration into small electronic devices without compromising functionality.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures efficient soldering and assembly processes, contributing to reliable and consistent product quality.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering and assembly of the product, ensuring robust connections for long-term performance.

Length: 7.8 mm

The compact length of 7.8 mm enhances the product's space-saving design, making it suitable for applications where size constraints are a consideration.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designation indicates that the product is designed to withstand harsh environmental conditions, making it suitable for industrial applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Being a general-purpose parallel I/O port peripheral IC type, the product offers versatility and compatibility with a wide range of devices and systems, making it a versatile choice for various applications.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption, high noise immunity, and compatibility with a variety of devices, making it a reliable and efficient choice.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and efficient soldering during assembly, ensuring reliability and durability of the product.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V offers a standard power option for compatibility with a wide range of devices, making the product versatile and easy to integrate.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, the product allows for precise and compact arrangement of terminals, enabling efficient connectivity and space-saving design.

No. of I/O Lines: 16

Having 16 I/O lines provides ample connectivity options for integrating external devices or peripherals, enhancing the product's versatility and compatibility with diverse systems.

Technical Specifications

Parallel I/O Ports PCA9539PWRE4 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

PCA9539PWRE4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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