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PCF8575DGVRG4

Texas Instruments

PCF8575DGVRG4 by Texas Instruments

PCF8575DGVRG4 by Texas Instruments is a Parallel I/O Port with 16 bits, 8-bit address bus width, and 2 ports. It operates b/w -40 to 85 °C with supply voltage ranging from 2.5V to 5.5V. Ideal for industrial applications requiring general-purpose parallel input/output capabilities in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,885 parts In-Stock

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4,885

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Digiode

USA . 4,319 parts In-Stock

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4,319

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Chip Stock

USA . 3,360 parts In-Stock

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3,360

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Distributors (Availability)

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AZTECH Wire

Italy . 806 parts In-Stock

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$10.700

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806

$10.700

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Parana Technologies

USA . 2,345 parts In-Stock

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$18.901

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$18.974

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2,345

$18.901

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$18.974

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DigiPath Technology Company

USA . 1,202 parts In-Stock

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$20.812

100+ parts

$19.147

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1,202

$20.812

$19.147

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ChromeModa Solutions

Germany . 5,402 parts In-Stock

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$21.237

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$17.414

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5,402

$21.237

$17.414

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IDEA Electronic Components Group

UK . 606 parts In-Stock

1+ parts

$21.237

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$20.175

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$19.113

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606

$21.237

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$19.113

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One Stop Electronics

USA . 183 parts In-Stock

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$22.000

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183

$22.000

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Corohmni

South Africa . 145 parts In-Stock

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$59.970

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145

$59.970

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Corphita

USA . 2,069 parts In-Stock

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Microchip USA

USA . 1,617 parts In-Stock

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Overview

Unlock unlimited possibilities with the Texas Instruments PCF8575DGVRG4, a high-quality Parallel I/O Port device designed for a wide range of industrial applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust in the reliability and performance of this product. Perfect for interfacing with various electronic components, this versatile device offers customers unparalleled value and benefits. Experience seamless integration and enhanced functionality with the PCF8575DGVRG4, setting new standards in parallel I/O port technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ideal for portable devices.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for compatibility with a wide range of systems and applications.

No. of Bits: 16

With 16 bits, this product offers a high level of data processing capabilities, suitable for handling complex parallel input and output operations.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures from -40 to 85°C ensures that this product can function reliably in various environmental conditions.

Maximum Clock Frequency: 0.4 MHz

The high maximum clock frequency of 0.4 MHz enables fast data transfer speeds, making this product suitable for applications requiring real-time parallel I/O operations.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Parallel I/O Ports PCF8575DGVRG4 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

Address Bus Width:

8

Maximum Clock Frequency:

.4 MHz

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Parallel IO Ports

Maximum Supply Current:

.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

PCF8575DGVRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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