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PCA9502BS,157

NXP Semiconductors

PCA9502BS,157 by NXP Semiconductors

NXP Semiconductors' PCA9502BS,157 is an 8-bit Parallel I/O Port with a supply voltage range of 2.3V to 2.7V and operating temperature from -40°C to 85°C. This CMOS technology chip carrier is surface-mountable and ideal for industrial applications requiring general-purpose parallel I/O functionality.

Median Price

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Lifecycle Status

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5

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1k+

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Verical

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Vyrian

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Ampacity Inc.

Singapore . 10 parts In-Stock

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Microchip USA

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AZTECH Wire

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Corohmni

South Africa . 5,223 parts In-Stock

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Continental Prestige Electronics

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Overview

Discover the ultimate solution for your parallel I/O port needs with the NXP Semiconductors PCA9502BS,157. This high-quality chip carrier offers unmatched reliability and performance in a compact and versatile package. Whether you're designing industrial automation systems or consumer electronics, this product provides seamless integration, optimal power supplies, and an extended temperature range for maximum flexibility. Elevate your projects with the cutting-edge technology and innovative design of NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 2.7 V

Suitable for systems with a maximum supply voltage of 2.7V, ensuring compatibility.

Package Shape: SQUARE

Square package shape offers ease of handling and integration into PCB layouts.

No. of Bits: 8

With 8 bits, this parallel I/O port provides sufficient data transfer capability for various applications.

Power Supplies (V): 2.5/3.3

Supports power supplies of 2.5V and 3.3V, making it versatile for different system requirements.

No. of Terminals: 24

With 24 terminals, this product offers ample connection options for interfacing with other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles provide flexibility in design and thermal management, catering to different application needs.

Minimum Supply Voltage: 2.3 V

The minimum supply voltage of 2.3V ensures stable operation even in low voltage scenarios.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85°C, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can function reliably in extreme low temperatures down to -40°C, making it suitable for a wide range of operating conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish ensures good conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position simplifies the connection process and allows for efficient signal routing.

Maximum Seated Height: 1 mm

Low seated height of 1mm enables compact and slim device designs.

Width: 4 mm

Compact width of 4mm saves space on the PCB layout.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for up to 30 seconds, ensuring proper soldering during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for reliable soldering during assembly processes.

Length: 4 mm

Short length of 4mm helps in achieving compact designs and efficient use of board space.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges, ensuring reliability in harsh environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, this product is versatile and can be used in a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

Terminal Form: NO LEAD

No-lead terminal form simplifies the manufacturing process and enhances reliability.

Nominal Supply Voltage: 2.5 V

Nominal supply voltage of 2.5V ensures stable and efficient operation in typical conditions.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting on PCBs, saving board space.

No. of I/O Lines: 8

With 8 I/O lines, this parallel I/O port provides sufficient connectivity for data exchange with external devices.

Technical Specifications

Parallel I/O Ports PCA9502BS,157 attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

Additional Features:

IT ALSO OPERATES AT 3.3V SUPPLY

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

PCA9502BS,157 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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