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PCA9555BSHP

NXP Semiconductors

PCA9555BSHP by NXP Semiconductors

PCA9555BSHP by NXP Semiconductors is a Parallel I/O Port with 16 I/O lines, operating voltage range of 2.3V to 5.5V, and industrial temperature grade (-40°C to 85°C). It comes in a square chip carrier package style with surface mount capability, suitable for general purpose parallel IO applications.

Median Price

$1.540

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

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$1.540

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$1.540

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Flip Electronics

USA . 5,090 parts In-Stock

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Anansix

USA . 2,380 parts In-Stock

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2,380

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Vyrian

USA . 1,276 parts In-Stock

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Digiode

USA . 799 parts In-Stock

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799

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Distributors (Availability)

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Argo Parts USA

USA . 4,916 parts In-Stock

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$1.540

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Continental Prestige Electronics

USA . 4,905 parts In-Stock

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$1.540

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$1.509

4,905

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$1.509

Netroflash

USA . 100 parts In-Stock

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$1.540

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$1.509

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100

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$1.509

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Corohmni

South Africa . 38 parts In-Stock

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$1.540

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38

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$1.586

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$1.507

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$1.507

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$1.586

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Microchip USA

USA . 7,964 parts In-Stock

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$7.978

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AZTECH Wire

Italy . 878 parts In-Stock

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$14.102

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Semicontronic

India . 666 parts In-Stock

1+ parts

$25.000

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$24.375

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$24.250

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666

$25.000

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$24.250

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One Stop Electronics

USA . 1,071 parts In-Stock

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$28.000

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Ampacity Inc.

Singapore . 576 parts In-Stock

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$32.000

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576

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Aztec Data Supply Inc.

USA . 2,472 parts In-Stock

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$57.270

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 1,147 parts In-Stock

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UNI Independent Distributors

Spain . 762 parts In-Stock

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Overview

Unlock endless possibilities with the PCA9555BSHP by NXP Semiconductors, a leading manufacturer known for top-quality components. This Parallel I/O Port device offers unparalleled value and benefits, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this versatile product provides reliable performance and ease of use. Experience seamless integration and enhanced functionality with the PCA9555BSHP, setting a new standard in the world of parallel I/O ports.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and reliable, ensuring the longevity of the product.

Maximum Supply Voltage: 5.5 V

Supports a high maximum supply voltage, making it versatile for various applications.

Minimum Supply Voltage: 2.3 V

Operates effectively even at low supply voltages, offering flexibility in power requirements.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Designed as a general-purpose Parallel I/O Port, suitable for a wide range of applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing efficiency.

Technical Specifications

Parallel I/O Ports PCA9555BSHP attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

PCA9555BSHP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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