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PCA9535RHLR

Texas Instruments

PCA9535RHLR by Texas Instruments

PCA9535RHLR by Texas Instruments is a 16-bit parallel I/O port with supply voltage range of 2.3V to 5.5V, ideal for industrial applications. It features CMOS technology, operates b/w -40°C to 85°C, and has a compact chip carrier package style. Suitable for various general-purpose peripheral IC designs requiring precise control over multiple I/O lines in tight spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,754 parts In-Stock

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5,754

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Digiode

USA . 2,036 parts In-Stock

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2,036

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,611 parts In-Stock

1+ parts

$3.000

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1,611

$3.000

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Parana Technologies

USA . 2,356 parts In-Stock

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$14.952

100+ parts

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$15.376

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2,356

$14.952

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$15.376

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AZTECH Wire

Italy . 628 parts In-Stock

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$16.282

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628

$16.282

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DigiPath Technology Company

USA . 2,305 parts In-Stock

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$16.464

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$15.147

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2,305

$16.464

$15.147

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IDEA Electronic Components Group

UK . 1,688 parts In-Stock

1+ parts

$16.800

100+ parts

$15.960

1k+ parts

$15.120

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1,688

$16.800

$15.960

$15.120

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ChromeModa Solutions

Germany . 1,643 parts In-Stock

1+ parts

$16.800

100+ parts

$13.776

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1,643

$16.800

$13.776

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Corohmni

South Africa . 466 parts In-Stock

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$49.191

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466

$49.191

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Corphita

USA . 4,591 parts In-Stock

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4,591

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Kepictronics

USA . 489 parts In-Stock

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489

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Overview

Unlock endless possibilities with the PCA9535RHLR by Texas Instruments. This high-quality parallel I/O port device offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. From industrial automation to consumer electronics, this versatile chip carrier delivers seamless integration and enhanced functionality. Experience the convenience and efficiency of Texas Instruments technology with the PCA9535RHLR – where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability in various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages, providing flexibility in power requirements.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on the PCB layout.

No. of Bits: 16

16-bit capability provides a wide range of addressing or data options.

Power Supplies (V): 2.5/5

Supports multiple power supply options for versatility in power management.

No. of Terminals: 24

With 24 terminals, there is ample room for connectivity and signal routing.

Minimum Supply Voltage: 2.3 V

Allows for operation at low supply voltages, suitable for power-efficient applications.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures stability in demanding conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold environments.

Terminal Position: QUAD

Quad terminal position offers efficient signal routing and connectivity.

No. of Ports: 2

Multiple ports allow for versatile interfacing with external devices or systems.

Maximum Seated Height: 1 mm

Low profile design is suitable for space-constrained applications.

Width: 3.5 mm

Compact width dimensions enable efficient PCB layout and space utilization.

Length: 5.5 mm

Optimal length for compact integration while providing ample connectivity options.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliability in harsh operating environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General purpose parallel I/O port offers flexibility for various applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: NO LEAD

No-lead terminal form simplifies manufacturing and enhances reliability.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage for consistent performance in standard operating conditions.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and compact PCB design.

No. of I/O Lines: 16

Provides 16 I/O lines for extensive interfacing capabilities.

Technical Specifications

Parallel I/O Ports PCA9535RHLR attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PQCC-N24

Length:

5.5 mm

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24/28,.14X.2,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3.5 mm

Peripheral IC Type:

Trade Compliance

PCA9535RHLR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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