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SNJ54LS612FK

Texas Instruments

SNJ54LS612FK by Texas Instruments

SNJ54LS612FK by Texas Instruments is a TTL technology chip carrier with 12 I/O lines, operating b/w -55 to 125 °C. It has a supply voltage range of 4.5V to 5.5V and is designed for military-grade applications requiring parallel I/O ports in a square package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,234 parts In-Stock

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Vyrian

USA . 2,263 parts In-Stock

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AZTECH Wire

Italy . 487 parts In-Stock

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$8.034

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One Stop Electronics

USA . 1,342 parts In-Stock

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$29.000

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Corohmni

South Africa . 100 parts In-Stock

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$47.038

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Parana Technologies

USA . 1,278 parts In-Stock

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$64.622

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DigiPath Technology Company

USA . 1,110 parts In-Stock

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$71.157

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$65.464

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IDEA Electronic Components Group

UK . 802 parts In-Stock

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$72.609

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$68.979

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$65.348

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802

$72.609

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ChromeModa Solutions

Germany . 419 parts In-Stock

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$72.609

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$59.539

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Corphita

USA . 873 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the SNJ54LS612FK by Texas Instruments, a cutting-edge Parallel I/O Ports chip that sets the industry standard. Built with top-quality materials and advanced technology, this versatile component offers endless possibilities for applications in various fields. From industrial automation to consumer electronics, this military-grade IC delivers exceptional functionality and efficiency. Upgrade your system with the SNJ54LS612FK and unlock a world of opportunities with Texas Instruments' superior engineering.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability for long-term use.

Surface Mount: YES

Being surface mountable makes it easy to integrate into various electronic devices and circuit boards.

Maximum Supply Voltage: 5.5 V

Support for a maximum supply voltage of 5.5V provides flexibility in powering the device.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board.

No. of Terminals: 44

With 44 terminals, this product offers versatility in connecting to other components or peripherals.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is well-suited for high-density mounting and space-saving designs.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C enables reliable performance even in demanding environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures functionality in a wide range of temperature conditions.

Terminal Position: QUAD

The quad terminal position simplifies the connection process and allows for easier integration into circuits.

Maximum Seated Height: 2.03 mm

The maximum seated height of 2.03mm enables a low-profile design for space-constrained applications.

Width: 16.51 mm

The 16.51mm width provides a compact form factor suitable for various electronic devices.

Length: 16.51 mm

The 16.51mm length offers a balanced size that can fit well within different designs.

Temperature Grade: MILITARY

The MILITARY temperature grade ensures ruggedness and reliability for use in harsh environmental conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

The general-purpose parallel I/O port type offers versatility and compatibility with a wide range of applications.

Technology: TTL

The TTL technology provides reliable and fast data transmission for efficient communication.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and improves the overall reliability of connections.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a standard value, ensuring compatibility with many power sources.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and secure connections with other components or devices.

No. of I/O Lines: 12

With 12 I/O lines, this product provides sufficient input and output options for various applications.

Technical Specifications

Parallel I/O Ports SNJ54LS612FK attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

S-CQCC-N44

Length:

16.51 mm

No. of I/O Lines:

12

No. of Ports:

1

No. of Terminals:

44

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.51 mm

Peripheral IC Type:

Trade Compliance

SNJ54LS612FK Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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