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SNJ54LS613JD

Texas Instruments

SNJ54LS613JD by Texas Instruments

SNJ54LS613JD by Texas Instruments is a MILITARY-grade Parallel I/O Port IC with 12 I/O lines. It operates b/w -55 to 125 °C, with supply voltage range of 4.5V to 5.5V. Ideal for applications requiring general purpose parallel input/output interfacing in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,759 parts In-Stock

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2,759

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Digiode

USA . 736 parts In-Stock

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736

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Distributors (Availability)

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AZTECH Wire

Italy . 562 parts In-Stock

1+ parts

$17.392

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562

$17.392

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One Stop Electronics

USA . 1,081 parts In-Stock

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$19.000

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1,081

$19.000

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Parana Technologies

USA . 1,348 parts In-Stock

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$39.000

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$39.000

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DigiPath Technology Company

USA . 561 parts In-Stock

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$42.944

100+ parts

$39.508

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561

$42.944

$39.508

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ChromeModa Solutions

Germany . 2,394 parts In-Stock

1+ parts

$43.820

100+ parts

$35.932

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2,394

$43.820

$35.932

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IDEA Electronic Components Group

UK . 702 parts In-Stock

1+ parts

$43.820

100+ parts

$41.629

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$39.438

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702

$43.820

$41.629

$39.438

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Corohmni

South Africa . 2,086 parts In-Stock

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$54.624

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$54.624

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Corphita

USA . 2,111 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the SNJ54LS613JD by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that guarantee reliability and performance. The SNJ54LS613JD falls under the category of Parallel I/O Ports, making it an essential component for applications requiring seamless data transfer. With its durable CERAMIC, METAL-SEALED COFIRED package body material and MILITARY-grade temperature rating, this product ensures longevity and stability even in harsh environments. Experience the value and benefits of this versatile device, offering 12 I/O lines and compatibility with TTL technology. Elevate your projects with the SNJ54LS613JD today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired materials ensures durability and reliability in harsh environments.

Maximum Supply Voltage: 5.5 V

Can accommodate a wide range of input voltages, providing flexibility in various applications.

Screening Level: 38535Q/M; 38534H; 883B

Compliance with stringent screening levels ensures high quality and reliability in military applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into existing systems and circuit layouts.

No. of Terminals: 40

Sufficient number of terminals for connecting multiple devices and peripherals.

Package Style (Meter): IN-LINE

In-line package style enables a compact and space-saving design.

Minimum Supply Voltage: 4.5 V

Allows operation at low voltage levels, conserving power and extending battery life.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures without compromising performance.

Minimum Operating Temperature: -55 °C

Can withstand extremely low temperatures, making it suitable for a wide range of environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and enhanced connectivity options.

Temperature Grade: MILITARY

Military-grade temperature handling ensures reliability in demanding and rugged conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Suitable for a variety of general-purpose parallel input/output applications.

Technology: TTL

TTL technology offers fast signal processing and compatibility with a wide range of devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage makes it compatible with most systems and devices.

Terminal Pitch: 2.54 mm

Optimal terminal pitch for easy PCB layout and component placement.

No. of I/O Lines: 12

Sufficient number of input/output lines for versatile connectivity and data transfer.

Technical Specifications

Parallel I/O Ports SNJ54LS613JD attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-CDIP-T40

No. of I/O Lines:

12

No. of Ports:

1

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SNJ54LS613JD Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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