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MAX7311ATG

NXP Semiconductors

MAX7311ATG by NXP Semiconductors

NXP Semiconductors' MAX7311ATG is a 16-bit Parallel I/O Port with a power supply range of 2-5.5V, ideal for automotive applications. This chip carrier package has 24 terminals and operates b/w -40 to 125°C. Utilizes BiCMOS technology and is surface mountable in a square shape package.

Median Price

$10.360

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

MAX7311ATG by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 568 parts In-Stock

1+ parts

$10.360

100+ parts

$7.003

1k+ parts

$6.403

10k+ parts

$6.257

568

$10.360

$7.003

$6.403

$6.257

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$4.542

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$4.542

-

-

-

Digiode

USA . 4,333 parts In-Stock

1+ parts

-

100+ parts

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4,333

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-

-

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Anansix

USA . 3,042 parts In-Stock

1+ parts

-

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3,042

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-

-

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Vyrian

USA . 1,255 parts In-Stock

1+ parts

-

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1,255

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-

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Prism Electronics

USA . 625 parts In-Stock

1+ parts

-

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1k+ parts

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625

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 2,251 parts In-Stock

1+ parts

$3.000

100+ parts

-

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10k+ parts

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2,251

$3.000

-

-

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Vigor

Singapore . 4,128 parts In-Stock

1+ parts

$3.060

100+ parts

-

1k+ parts

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10k+ parts

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4,128

$3.060

-

-

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Continental Prestige Electronics

USA . 5,611 parts In-Stock

1+ parts

$4.542

100+ parts

-

1k+ parts

-

10k+ parts

$4.451

5,611

$4.542

-

-

$4.451

Netroflash

USA . 500 parts In-Stock

1+ parts

$4.542

100+ parts

$4.451

1k+ parts

-

10k+ parts

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500

$4.542

$4.451

-

-

Component Stockers USA

USA . 7,099 parts In-Stock

1+ parts

$6.840

100+ parts

$4.970

1k+ parts

$3.950

10k+ parts

-

7,099

$6.840

$4.970

$3.950

-

Semicontronic

India . 650 parts In-Stock

1+ parts

$14.000

100+ parts

$13.650

1k+ parts

$13.580

10k+ parts

-

650

$14.000

$13.650

$13.580

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AZTECH Wire

Italy . 347 parts In-Stock

1+ parts

$19.237

100+ parts

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347

$19.237

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Ampacity Inc.

Singapore . 192 parts In-Stock

1+ parts

$31.000

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192

$31.000

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MARBEL Systems

Belgium . 2,324 parts In-Stock

1+ parts

$35.010

100+ parts

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2,324

$35.010

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Texas Native Microelectronics

USA . 350 parts In-Stock

1+ parts

$40.241

100+ parts

-

1k+ parts

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10k+ parts

$35.412

350

$40.241

-

-

$35.412

Kenton Components

USA . 5,234 parts In-Stock

1+ parts

$48.289

100+ parts

-

1k+ parts

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10k+ parts

$42.494

5,234

$48.289

-

-

$42.494

Corohmni

South Africa . 5,048 parts In-Stock

1+ parts

$48.647

100+ parts

-

1k+ parts

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10k+ parts

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5,048

$48.647

-

-

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Qasali Group International

UK . 3,796 parts In-Stock

1+ parts

$108.651

100+ parts

-

1k+ parts

-

10k+ parts

$95.613

3,796

$108.651

-

-

$95.613

Argo Parts USA

USA . 4,243 parts In-Stock

1+ parts

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4,243

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Corphita

USA . 2,118 parts In-Stock

1+ parts

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2,118

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Microchip USA

USA . 1,996 parts In-Stock

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1,996

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UNI Independent Distributors

Spain . 1,494 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,494

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Computer Components Inc. - USA

USA . 50 parts In-Stock

1+ parts

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100+ parts

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50

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-

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Overview

Unlock the power of seamless connectivity and efficient data transfer with the MAX7311ATG from NXP Semiconductors. Crafted with precision and expertise, this parallel I/O port offers unparalleled reliability and performance. Ideal for a wide range of applications, this innovative product ensures smooth operation and enhanced functionality. Experience the value and benefits of cutting-edge technology with the MAX7311ATG, providing customers with advanced solutions for all their connectivity needs. Elevate your projects with the superior quality and advantages of NXP Semiconductors, setting a new standard in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

No. of Bits: 16

Having 16 bits provides a high level of data transfer capability, making the product suitable for tasks requiring complex parallel I/O operations.

Power Supplies (V): 2/5.5

The wide range of power supplies (2-5.5V) allows for flexibility in different voltage requirements, making it versatile for various applications.

Temperature Grade: AUTOMOTIVE

With automotive-grade temperature tolerance (-40 to 125°C), the product is designed to withstand harsh environmental conditions, making it ideal for automotive applications.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Technical Specifications

Parallel I/O Ports MAX7311ATG attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

No. of Bits:

16

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/5.5

Qualification:

Not Qualified

Sub-Category:

Parallel IO Port

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

MAX7311ATG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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