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PCA9554DWT

Texas Instruments

PCA9554DWT by Texas Instruments

PCA9554DWT by Texas Instruments is an 8-bit parallel I/O port with a supply voltage range of 2.3V to 5.5V, suitable for industrial applications. It features a small outline package with 16 terminals and operates b/w -40°C to 85°C temperature range. Ideal for general purpose peripheral IC applications requiring CMOS technology and gull wing terminal form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,608 parts In-Stock

1+ parts

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7,608

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Digiode

USA . 3,573 parts In-Stock

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3,573

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 507 parts In-Stock

1+ parts

$2.000

100+ parts

-

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507

$2.000

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Corohmni

South Africa . 2,119 parts In-Stock

1+ parts

$15.308

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2,119

$15.308

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AZTECH Wire

Italy . 615 parts In-Stock

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$16.456

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615

$16.456

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Parana Technologies

USA . 2,331 parts In-Stock

1+ parts

$21.250

100+ parts

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$21.551

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2,331

$21.250

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$21.551

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DigiPath Technology Company

USA . 51 parts In-Stock

1+ parts

$23.398

100+ parts

$21.527

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51

$23.398

$21.527

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ChromeModa Solutions

Germany . 4,055 parts In-Stock

1+ parts

$23.876

100+ parts

$19.578

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4,055

$23.876

$19.578

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IDEA Electronic Components Group

UK . 1,492 parts In-Stock

1+ parts

$23.876

100+ parts

$22.682

1k+ parts

$21.488

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1,492

$23.876

$22.682

$21.488

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Corphita

USA . 789 parts In-Stock

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789

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Overview

Unlock the power of versatile parallel I/O ports with the PCA9554DWT by Texas Instruments. Designed with precision and quality in mind, this product offers endless possibilities for various applications. From industrial automation to consumer electronics, this small outline package delivers exceptional performance and reliability. With a maximum supply voltage of 5.5V and minimum operating temperature of -40°C, the PCA9554DWT provides customers with the value, benefits, and advantages they need to bring their projects to life. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and heat resistance, ensuring a reliable product.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and facilitating mass production.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for compatibility with a wide range of systems and power sources.

Package Shape: RECTANGULAR

The rectangular shape easily fits into standard PCB layouts and reduces the risk of misalignment during assembly.

No. of Bits: 8

With 8 bits, this parallel I/O port can handle a range of data inputs and outputs, making it versatile for various applications.

Power Supplies (V): 2.5/5

The dual power supply options provide flexibility for different voltage requirements, making it suitable for diverse electronics projects.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and ensures stable signal transmission between the device and external components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, enabling compact designs and efficient use of board real estate.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage ensures energy efficiency and allows the device to operate in low-power scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes this parallel I/O port suitable for industrial environments with demanding conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the device to function reliably in extreme cold environments, adding to its robustness.

Terminal Position: DUAL

The dual terminal position provides flexibility in connecting the port to external devices, accommodating different wiring configurations.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature tolerance ensures the device can withstand harsh working conditions, making it suitable for rugged applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Designed as a general-purpose parallel I/O port, this product offers versatility for various projects and can be easily integrated into different systems.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, contributing to the efficiency and reliability of the device.

Terminal Form: GULL WING

The gull-wing terminal form offers easy soldering and strong mechanical connections, ensuring secure attachment to the PCB.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is commonly used in many electronics systems, enhancing compatibility and ease of integration.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and compact connections, facilitating installation and reducing the risk of short circuits.

No. of I/O Lines: 8

With 8 I/O lines, this parallel I/O port can handle multiple input and output signals simultaneously, enabling complex interactions with external devices.

Technical Specifications

Parallel I/O Ports PCA9554DWT attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

No. of Bits:

8

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

PCA9554DWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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