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MCP23S17T-E/MLVAO

Microchip Technology

MCP23S17T-E/MLVAO by Microchip Technology

MCP23S17T-E/MLVAO by Microchip: 16-bit parallel I/O port with 2 ports, CMOS technology, and 10 MHz clock frequency. Ideal for automotive applications due to AEC-Q100 screening and TS 16949 compliance. Package style is chip carrier with very thin profile and matte tin terminal finish.

Median Price

$1.540

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$1.540

100+ parts

-

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200

$1.540

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Vyrian

USA . 6,155 parts In-Stock

1+ parts

-

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6,155

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,172 parts In-Stock

1+ parts

$1.540

100+ parts

-

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3,172

$1.540

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Continental Prestige Electronics

USA . 1,342 parts In-Stock

1+ parts

$1.540

100+ parts

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1k+ parts

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$1.509

1,342

$1.540

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-

$1.509

Ampacity Inc.

Singapore . 6,095 parts In-Stock

1+ parts

$1.900

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6,095

$1.900

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Semicontronic

India . 6,373 parts In-Stock

1+ parts

$4.140

100+ parts

$4.036

1k+ parts

$4.016

10k+ parts

-

6,373

$4.140

$4.036

$4.016

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$17.894

100+ parts

$16.999

1k+ parts

$16.999

10k+ parts

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2,500

$17.894

$16.999

$16.999

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Corohmni

South Africa . 2,879 parts In-Stock

1+ parts

$26.412

100+ parts

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2,879

$26.412

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Aztec Data Supply Inc.

USA . 4,114 parts In-Stock

1+ parts

$59.178

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4,114

$59.178

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$1.509

1k+ parts

$1.463

10k+ parts

$1.432

2,000

-

$1.509

$1.463

$1.432

Fulton Briggs Corp.

USA . 1,296 parts In-Stock

1+ parts

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1,296

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Robosynatics

Brazil . 950 parts In-Stock

1+ parts

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950

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Lucentia Tech

USA . 950 parts In-Stock

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950

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Overview

Unlock the potential of your electronic projects with the MCP23S17T-E/MLVAO by Microchip Technology. This high-quality Parallel I/O Port device boasts top-notch manufacturing standards, making it a reliable choice for a wide range of applications. With its impressive features and versatile capabilities, this product offers unparalleled value and benefits to customers looking to streamline their projects and enhance performance. Trust Microchip Technology to deliver quality solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability.

Surface Mount: YES

Easy to install and saves space on the PCB.

Maximum Supply Voltage: 5.5 V

Can handle high voltage inputs for versatile applications.

Screening Level: AEC-Q100; TS 16949

Meets automotive quality standards for reliability.

Package Shape: SQUARE

Compact design for efficient use of space on the board.

No. of Bits: 16

Provides ample capacity for data transmission.

No. of Terminals: 28

Offers flexibility in connecting to other components.

Package Style: CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

Efficient heat dissipation for improved performance.

Minimum Supply Voltage: 4.5 V

Can operate even with lower power sources.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions.

Terminal Finish: Matte Tin (Sn)

Provides a reliable connection for improved conductivity.

Terminal Position: QUAD

Easy to interface with other devices.

No. of Ports: 2

Allows for multiple connections for expanded functionality.

Maximum Seated Height: 1 mm

Low profile design for space-constrained applications.

Width: 6 mm

Compact size for efficient board layout.

Maximum Clock Frequency: 10 MHz

Supports high-speed data transfer.

Length: 6 mm

Compact size for dense PCB designs.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Versatile and suitable for various applications.

Technology: CMOS

Provides low power consumption and high noise immunity.

Terminal Form: NO LEAD

Environmentally friendly and compliant with regulations.

Maximum Supply Current: 1 mA

Energy efficient for minimal power consumption.

Nominal Supply Voltage: 5 V

Standard voltage level for compatibility with various systems.

Terminal Pitch: 0.65 mm

Fine pitch for compact layout on the PCB.

No. of I/O Lines: 16

Sufficient I/O lines for connecting to peripherals.

Technical Specifications

Parallel I/O Ports MCP23S17T-E/MLVAO attributes and parameters. Explore more Parallel I/O Ports devices from Microchip Technology

Specs

Maximum Clock Frequency:

10 MHz

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

6 mm

Peripheral IC Type:

Trade Compliance

MCP23S17T-E/MLVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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