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PCA8575DK,118

NXP Semiconductors

PCA8575DK,118 by NXP Semiconductors

NXP Semiconductors' PCA8575DK,118 is a CMOS Parallel I/O Port with 18 I/O lines. Operating b/w -40 to 85°C, it supports supply voltage range of 2.3V to 5.5V. Ideal for industrial applications requiring small outline package and surface mount technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,592 parts In-Stock

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Digiode

USA . 2,658 parts In-Stock

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Anansix

USA . 2,620 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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AZTECH Wire

Italy . 678 parts In-Stock

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$5.090

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One Stop Electronics

USA . 402 parts In-Stock

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$32.000

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402

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Corohmni

South Africa . 1,894 parts In-Stock

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$33.175

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Aztec Data Supply Inc.

USA . 1,655 parts In-Stock

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$61.040

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Microchip USA

USA . 6,051 parts In-Stock

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Continental Prestige Electronics

USA . 4,882 parts In-Stock

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Corphita

USA . 4,571 parts In-Stock

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UNI Independent Distributors

Spain . 4,252 parts In-Stock

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Argo Parts USA

USA . 3,482 parts In-Stock

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Bastille Electronics

Australia . 37 parts In-Stock

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Overview

Unlock endless possibilities with the PCA8575DK,118 by NXP Semiconductors, a leader in innovative semiconductor solutions. This parallel I/O port device offers unparalleled quality and reliability, perfect for various industrial applications. With its advanced technology and versatile features, customers can experience seamless integration and enhanced performance. Discover the value and benefits of this cutting-edge product, designed to elevate your projects to new heights. Choose NXP Semiconductors for superior products that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and resistance to environmental factors, making it a reliable choice.

Surface Mount

YES - Allows for easy installation and integration into PCB designs, saving time and effort.

Maximum Supply Voltage

5.5 V - Supports a wide range of voltage requirements, making it versatile for various applications.

Package Shape

RECTANGULAR - Offers a compact design that saves space on the circuit board.

No. of Terminals

24 - Provides ample connection points for multiple devices or components, increasing flexibility.

Package Style (Meter)

SMALL OUTLINE, SHRINK PITCH - Enhances overall package size efficiency, making it suitable for compact designs.

Minimum Supply Voltage

2.3 V - Allows for operation in low power environments, saving energy and reducing costs.

Maximum Operating Temperature

85 °C - Ensures reliable performance in high-temperature environments, increasing product longevity.

Minimum Operating Temperature

40 °C - Enables operation in extreme cold conditions, expanding the range of potential applications.

Terminal Finish

NICKEL PALLADIUM GOLD - Provides superior conductivity and corrosion resistance, ensuring reliable signal transmission.

Terminal Position

DUAL - Offers redundancy and increased stability in connection, reducing the risk of signal loss.

Maximum Seated Height

1.73 mm - Enables a low-profile design, ideal for space-constrained applications.

Width

3.9 mm - Compact size allows for efficient use of PCB real estate, optimizing layout design.

Length

8.7 mm - Provides a balanced form factor for easy integration into various PCB layouts.

Temperature Grade

INDUSTRIAL - Suitable for harsh industrial environments, ensuring reliable operation in demanding conditions.

Peripheral IC Type

PARALLEL IO PORT, GENERAL PURPOSE - Versatile interface for a wide range of applications, providing flexibility for different tasks.

Technology

CMOS - Low power consumption and high noise immunity, enhancing overall performance and reliability.

Terminal Form

GULL WING - Facilitates easy soldering and robust mechanical strength, ensuring secure connections.

Terminal Pitch

0.635 mm - Allows for close positioning of terminals, reducing signal interference and maximizing data throughput.

No. of I/O Lines

18 - Provides sufficient I/O options for connecting multiple devices, enhancing overall functionality.

Technical Specifications

Parallel I/O Ports PCA8575DK,118 attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

18

No. of Ports:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.73 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

PCA8575DK,118 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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