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PCA9673PW,112

NXP Semiconductors

PCA9673PW,112 by NXP Semiconductors

PCA9673PW,112 by NXP Semiconductors is a 16-bit parallel I/O port with 2.5/5V power supplies and -40 to 85°C operating temperature range. It features small outline thin profile packaging suitable for industrial applications requiring general-purpose parallel I/O functionality.

Median Price

$2.850

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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NAC Semi

USA . 239 parts In-Stock

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$2.850

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Vyrian

USA . 8,988 parts In-Stock

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Anansix

USA . 1,959 parts In-Stock

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Digiode

USA . 1,514 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Component Stockers USA

USA . 149 parts In-Stock

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$2.740

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$2.740

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One Stop Electronics

USA . 825 parts In-Stock

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$3.000

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Microchip USA

USA . 348 parts In-Stock

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$15.100

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AZTECH Wire

Italy . 836 parts In-Stock

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$17.667

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Ampacity Inc.

Singapore . 1,434 parts In-Stock

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$20.000

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Aztec Data Supply Inc.

USA . 4,095 parts In-Stock

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$63.496

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Corohmni

South Africa . 195 parts In-Stock

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$86.451

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Continental Prestige Electronics

USA . 4,857 parts In-Stock

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Corphita

USA . 3,583 parts In-Stock

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Argo Parts USA

USA . 2,974 parts In-Stock

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UNI Independent Distributors

Spain . 1,716 parts In-Stock

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Aranea Global

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Perfect Parts

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Overview

Discover the unparalleled quality and reliability of NXP Semiconductors with the PCA9673PW,112 Parallel I/O Port. This cutting-edge technology offers 16 bits of parallel input/output lines, providing endless possibilities for industrial applications. With a wide operating temperature range and durable packaging, this versatile component ensures optimal performance in any environment. Trust NXP Semiconductors to deliver superior products that exceed expectations and drive innovation in your projects. Experience the difference with the PCA9673PW,112 - the ultimate solution for all your parallel I/O needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage offers flexibility in power sourcing.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and easy to work with in design layouts.

No. of Bits: 16

16 bits provide a wide range of input/output capabilities.

Power Supplies (V): 2.5/5

Multiple power supply options allow for compatibility with various systems.

No. of Terminals: 24

Ample terminals enable connections to multiple devices or components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on circuit boards and improves overall design efficiency.

Minimum Supply Voltage: 2.3 V

Low minimum supply voltage ensures reliable operation even in low power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes the product suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in a wide range of conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Quality terminal finish ensures good conductivity and resistance to corrosion.

Terminal Position: DUAL

Dual terminal position offers flexibility in connection options.

Maximum Seated Height: 1.1 mm

Low seated height minimizes space requirements in compact designs.

Width: 4.4 mm

Narrow width facilitates efficient placement on circuit boards.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature prevents heat damage during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering for reliable connections.

Length: 7.8 mm

Compact length contributes to overall space-saving design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Designed for general-purpose parallel input/output operations, offering versatility in application.

Technology: CMOS

CMOS technology ensures low power consumption and reliable operation.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and secure connections.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density mounting on circuit boards.

No. of I/O Lines: 18

18 I/O lines provide ample connectivity options for input and output operations.

Technical Specifications

Parallel I/O Ports PCA9673PW,112 attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

18

No. of Ports:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

PCA9673PW,112 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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