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PCA9555DB,112

NXP Semiconductors

PCA9555DB,112 by NXP Semiconductors

PCA9555DB,112 by NXP Semiconductors is a 16-bit parallel I/O port with 2.3V to 5.5V supply voltage range and -40°C to 85°C operating temperature. It features small outline package, dual terminal position, and CMOS technology suitable for industrial applications requiring general-purpose parallel I/O functionality.

Median Price

$1.320

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 43 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

$1.100

10k+ parts

$0.977

43

-

$1.320

$1.100

$0.977

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 71 parts In-Stock

1+ parts

$0.970

100+ parts

-

1k+ parts

-

10k+ parts

-

71

$0.970

-

-

-

Digiode

USA . 2,856 parts In-Stock

1+ parts

$1.026

100+ parts

-

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-

10k+ parts

-

2,856

$1.026

-

-

-

Vyrian

USA . 6,299 parts In-Stock

1+ parts

-

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6,299

-

-

-

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Anansix

USA . 1,950 parts In-Stock

1+ parts

-

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-

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1,950

-

-

-

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Inventory MP

USA . 143 parts In-Stock

1+ parts

-

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-

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143

-

-

-

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Bristol Electronics

USA . 143 parts In-Stock

1+ parts

-

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143

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Speed Components Ltd

Israel . 41 parts In-Stock

1+ parts

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41

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Connector Distribution Corp

USA . 20 parts In-Stock

1+ parts

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20

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Right Parts Inc.

USA . 20 parts In-Stock

1+ parts

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20

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 43 parts In-Stock

1+ parts

$0.920

100+ parts

-

1k+ parts

-

10k+ parts

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43

$0.920

-

-

-

Semicontronic

India . 43 parts In-Stock

1+ parts

$0.920

100+ parts

$0.897

1k+ parts

$0.892

10k+ parts

-

43

$0.920

$0.897

$0.892

-

Corohmni

South Africa . 3,543 parts In-Stock

1+ parts

$0.970

100+ parts

-

1k+ parts

-

10k+ parts

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3,543

$0.970

-

-

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Argo Parts USA

USA . 832 parts In-Stock

1+ parts

$0.970

100+ parts

-

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832

$0.970

-

-

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Continental Prestige Electronics

USA . 92 parts In-Stock

1+ parts

$0.970

100+ parts

-

1k+ parts

-

10k+ parts

$0.951

92

$0.970

-

-

$0.951

Corphita

USA . 872 parts In-Stock

1+ parts

$0.972

100+ parts

-

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872

$0.972

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$0.999

100+ parts

$0.949

1k+ parts

$0.949

10k+ parts

-

2,500

$0.999

$0.949

$0.949

-

Microchip USA

USA . 395 parts In-Stock

1+ parts

$7.160

100+ parts

$7.160

1k+ parts

$7.160

10k+ parts

$7.160

395

$7.160

$7.160

$7.160

$7.160

AZTECH Wire

Italy . 433 parts In-Stock

1+ parts

$9.381

100+ parts

-

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433

$9.381

-

-

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Aztec Data Supply Inc.

USA . 3,161 parts In-Stock

1+ parts

$15.331

100+ parts

-

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3,161

$15.331

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UNI Independent Distributors

Spain . 4,709 parts In-Stock

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4,709

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Perfect Parts

USA . 1,503 parts In-Stock

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1,503

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Overview

Unlock endless possibilities with the PCA9555DB,112 by NXP Semiconductors. This parallel I/O port device offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this product provides customers with exceptional value and countless benefits. Experience seamless integration, enhanced functionality, and improved performance with the PCA9555DB,112 - your key to maximizing efficiency and productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for the package body ensures the product's longevity and stability.

Surface Mount: YES

Ease of installation and compatibility with modern PCB designs.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options.

Package Shape: RECTANGULAR

Space-efficient design for optimal PCB layout.

No. of Bits: 16

Sufficient number of bits for versatile parallel I/O operations.

Power Supplies (V): 2.5/5

Ability to operate with multiple power supply voltages.

No. of Terminals: 24

Sufficient terminals for connecting multiple devices and peripherals.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact package design that saves space on the PCB.

Minimum Supply Voltage: 2.3 V

Can operate at low supply voltages efficiently.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range for versatility in different environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish for reliable connections and corrosion resistance.

Terminal Position: DUAL

Dual terminal position for added flexibility in PCB layout.

No. of Ports: 2

Multiple ports for simultaneous data transfer and communication.

Maximum Seated Height: 2 mm

Low profile design for compact PCB assemblies.

Width: 5.3 mm

Compact width for space-saving integration on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

Ideal reflow temperature time for reliable solder connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature for robust soldering.

Length: 8.2 mm

Optimal length for efficient PCB layout and integration.

Temperature Grade: INDUSTRIAL

Meets industrial temperature standards for rugged applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Versatile parallel I/O port for general-purpose use.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminal form for easy surface mounting and durability.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage for consistent performance.

Terminal Pitch: 0.65 mm

Fine terminal pitch for high-density PCB layouts.

No. of I/O Lines: 16

Sufficient number of I/O lines for versatile connectivity options.

Technical Specifications

Parallel I/O Ports PCA9555DB,112 attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

PCA9555DB,112 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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