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PCA9554ADGV

Texas Instruments

PCA9554ADGV by Texas Instruments

PCA9554ADGV by Texas Instruments is an 8-bit parallel I/O port with a max supply voltage of 5.5V and operating temperature range from -40 to 85°C. It features a small outline package style, suitable for industrial applications requiring general-purpose parallel I/O functionality at a clock frequency of up to 0.4MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,613 parts In-Stock

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8,613

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Digiode

USA . 173 parts In-Stock

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173

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Distributors (Availability)

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AZTECH Wire

Italy . 615 parts In-Stock

1+ parts

$15.323

100+ parts

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615

$15.323

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Corohmni

South Africa . 997 parts In-Stock

1+ parts

$21.966

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997

$21.966

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One Stop Electronics

USA . 180 parts In-Stock

1+ parts

$32.000

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180

$32.000

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Parana Technologies

USA . 1,943 parts In-Stock

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$70.601

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1,943

$70.601

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DigiPath Technology Company

USA . 222 parts In-Stock

1+ parts

$77.740

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222

$77.740

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ChromeModa Solutions

Germany . 1,549 parts In-Stock

1+ parts

$79.327

100+ parts

$65.048

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1,549

$79.327

$65.048

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IDEA Electronic Components Group

UK . 445 parts In-Stock

1+ parts

$79.327

100+ parts

$75.361

1k+ parts

$71.394

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445

$79.327

$75.361

$71.394

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Corphita

USA . 4,222 parts In-Stock

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4,222

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the PCA9554ADGV, a versatile Parallel I/O Port that offers exceptional performance in a wide range of applications. This innovative product boasts a compact design and a wide operating temperature range, making it ideal for industrial environments. With dual terminal position and a high clock frequency, the PCA9554ADGV provides customers with seamless connectivity and precise control. Elevate your projects with the cutting-edge technology and superior craftsmanship of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is commonly used in electronic packaging due to its durability and resistance to impact, making this product a reliable choice for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and reducing the need for manual soldering, making this product more efficient to integrate into electronic devices.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can be used with a wide range of devices without risk of damage, providing versatility in application.

Address Bus Width: 8

Having an address bus width of 8 allows for efficient communication and data transfer between various components, enhancing overall system performance.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage requirement makes this product energy-efficient and suitable for battery-powered devices, extending battery life.

Maximum Operating Temperature: 85 °C

This high maximum operating temperature ensures the product can withstand harsh environmental conditions, making it reliable for use in industrial settings.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold in terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity of the product.

No. of I/O Lines: 8

Having 8 I/O lines allows for versatile input and output configurations, providing flexibility in connecting to external devices and peripherals.

Technical Specifications

Parallel I/O Ports PCA9554ADGV attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

Address Bus Width:

8

Maximum Clock Frequency:

.4 MHz

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.4 mm

No. of Bits:

8

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Parallel IO Ports

Maximum Supply Current:

.175 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

3.6 mm

Peripheral IC Type:

Trade Compliance

PCA9554ADGV Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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