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PCA9539DWG4

Texas Instruments

PCA9539DWG4 by Texas Instruments

PCA9539DWG4 by Texas Instruments is a 16-bit parallel I/O port with 2.5/5V power supplies, operating from -40 to 85°C. It features a max clock frequency of 0.4MHz and is ideal for industrial applications requiring general-purpose parallel I/O functionality in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,681 parts In-Stock

1+ parts

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7,681

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Digiode

USA . 4,830 parts In-Stock

1+ parts

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4,830

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 354 parts In-Stock

1+ parts

$11.000

100+ parts

-

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354

$11.000

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AZTECH Wire

Italy . 556 parts In-Stock

1+ parts

$16.073

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556

$16.073

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Parana Technologies

USA . 1,738 parts In-Stock

1+ parts

$33.999

100+ parts

-

1k+ parts

$139.251

10k+ parts

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1,738

$33.999

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$139.251

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DigiPath Technology Company

USA . 851 parts In-Stock

1+ parts

$37.437

100+ parts

$34.442

1k+ parts

-

10k+ parts

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851

$37.437

$34.442

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ChromeModa Solutions

Germany . 4,356 parts In-Stock

1+ parts

$38.201

100+ parts

$31.325

1k+ parts

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10k+ parts

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4,356

$38.201

$31.325

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IDEA Electronic Components Group

UK . 2,132 parts In-Stock

1+ parts

$38.201

100+ parts

$36.291

1k+ parts

$34.381

10k+ parts

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2,132

$38.201

$36.291

$34.381

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Corohmni

South Africa . 672 parts In-Stock

1+ parts

$52.591

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672

$52.591

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Corphita

USA . 2,774 parts In-Stock

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2,774

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Overview

Enhance your electronic designs with the PCA9539DWG4 from Texas Instruments, a leading manufacturer known for top-quality components. This parallel I/O port offers unparalleled versatility and reliability for a wide range of applications. With its small outline package and dual terminal position, this product provides ease of use and flexibility. Experience the benefits of improved performance, efficiency, and functionality with the PCA9539DWG4. Elevate your projects with this innovative solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for electronic components

Maximum Supply Voltage: 5.5 V

Allows for a wide range of input voltage, increasing flexibility in design

No. of Bits: 16

Offers a high number of bits for data transmission, suitable for various applications

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, making it reliable in different conditions

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for excellent conductivity and durability

Maximum Clock Frequency: 0.4 MHz

Fast clock frequency allows for quick data processing and communication

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity

Technical Specifications

Parallel I/O Ports PCA9539DWG4 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

Maximum Clock Frequency:

.4 MHz

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Parallel IO Port

Maximum Supply Current:

.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

PCA9539DWG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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