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PCA9535BS-T

NXP Semiconductors

PCA9535BS-T by NXP Semiconductors

PCA9535BS-T by NXP Semiconductors is a 16-bit Parallel I/O Port with 2.3V to 5.5V supply voltage range, ideal for industrial applications. It features CMOS technology, quad terminal position, and nickel palladium gold finish in a compact chip carrier package style. With a wide temperature range of -40°C to 85°C, it offers versatile usage in various electronic systems requiring precise I/O control.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,067 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,130 parts In-Stock

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Digiode

USA . 683 parts In-Stock

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683

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Vyrian

USA . 343 parts In-Stock

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343

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Ampacity Inc.

Singapore . 896 parts In-Stock

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$7.000

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AZTECH Wire

Italy . 891 parts In-Stock

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$8.246

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One Stop Electronics

USA . 191 parts In-Stock

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$10.000

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Semicontronic

India . 1,175 parts In-Stock

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$15.000

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$14.625

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$14.550

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Aztec Data Supply Inc.

USA . 2,474 parts In-Stock

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$15.120

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Corohmni

South Africa . 2,731 parts In-Stock

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$21.719

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$38.675

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$36.742

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Corphita

USA . 3,769 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

USA . 1,986 parts In-Stock

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Modulus Dynamics

Lithuania . 500 parts In-Stock

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UNI Independent Distributors

Spain . 403 parts In-Stock

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Bastille Electronics

Australia . 55 parts In-Stock

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Perfect Parts

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Overview

Enhance your electronic designs with the PCA9535BS-T from NXP Semiconductors, a leading manufacturer known for top-quality products. This Parallel I/O Ports device offers versatile applications and reliable performance, ensuring seamless integration into various projects. With its advanced technology and industrial-grade components, this chip carrier provides customers with unmatched value and benefits. Experience the convenience of 16 I/O lines, 2 ports, and a wide temperature range, making it the perfect choice for your next project. Elevate your designs with the PCA9535BS-T and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to environmental factors, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

Ability to handle a maximum supply voltage of 5.5V makes the product versatile and compatible with a wide range of power sources.

Package Shape: SQUARE

Square package shape offers compact design and efficient use of space on a circuit board.

No. of Bits: 16

16 bits provide a high level of data processing capability, allowing for complex parallel I/O operations.

Power Supplies (V): 2.5/5

Dual power supply options of 2.5V and 5V provide flexibility in designing and implementing the product in different voltage environments.

No. of Terminals: 24

Having 24 terminals allows for multiple connections and interfaces, enhancing the product's functionality and versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Chip carrier style with heat sink/slug and very thin profile offers efficient heat dissipation and space-saving design.

Minimum Supply Voltage: 2.3 V

With a minimum supply voltage of 2.3V, the product can operate efficiently even in low power conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance of 85°C ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature (-40°C) enables the product to withstand extreme cold conditions without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers superior conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal position facilitates secure connections and stable operation, reducing the risk of signal loss or disconnection.

No. of Ports: 2

Dual ports allow for simultaneous data transfer and multi-tasking capabilities, enhancing the product's overall performance.

Maximum Seated Height: 1 mm

Low maximum seated height of 1mm enables the product to be used in compact electronic devices or applications with space constraints.

Width: 4 mm

Compact width of 4mm ensures efficient use of space on a circuit board and easy integration into electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the product can undergo heat reflow processes efficiently during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C enables the product to withstand soldering processes without damage or degradation.

Length: 4 mm

Compact length of 4mm contributes to the overall small form factor of the product, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments with fluctuating temperatures.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General-purpose parallel I/O port IC type offers versatility and broad applicability in various electronic systems and devices.

Technology: CMOS

CMOS technology provides low power consumption and high speed performance, making the product energy-efficient and reliable in data processing tasks.

Terminal Form: NO LEAD

No-lead terminal form eliminates the risk of lead contamination and ensures compliance with environmental regulations.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3V ensures consistent and reliable performance in electronic systems powered by 3V sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for precise connections and compact design, enhancing the product's overall efficiency and reliability.

No. of I/O Lines: 16

Having 16 I/O lines provides ample connectivity options and data transfer capabilities, meeting the needs of complex parallel I/O operations.

Technical Specifications

Parallel I/O Ports PCA9535BS-T attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

PCA9535BS-T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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