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PCA9557PWG4

Texas Instruments

PCA9557PWG4 by Texas Instruments

PCA9557PWG4 by Texas Instruments is an 8-bit parallel I/O port with supply voltage range of 2.3V to 5.5V, ideal for industrial applications. It features a small outline package with dual terminals and operates in temperatures from -40°C to 85°C. This CMOS technology device has a terminal pitch of 0.65mm and is surface mountable, making it suitable for various general purpose applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,614 parts In-Stock

1+ parts

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3,614

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Digiode

USA . 2,475 parts In-Stock

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2,475

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Nova Conductors

Japan . 62 parts In-Stock

1+ parts

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62

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 257 parts In-Stock

1+ parts

$5.509

100+ parts

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257

$5.509

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Corohmni

South Africa . 1,169 parts In-Stock

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$18.800

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1,169

$18.800

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Parana Technologies

USA . 2,091 parts In-Stock

1+ parts

$22.785

100+ parts

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$23.452

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2,091

$22.785

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$23.452

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ChromeModa Solutions

Germany . 3,772 parts In-Stock

1+ parts

$25.601

100+ parts

$20.993

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3,772

$25.601

$20.993

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IDEA Electronic Components Group

UK . 1,928 parts In-Stock

1+ parts

$25.601

100+ parts

$24.321

1k+ parts

$23.041

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1,928

$25.601

$24.321

$23.041

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Ampacity Inc.

Singapore . 1,124 parts In-Stock

1+ parts

$31.000

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1,124

$31.000

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One Stop Electronics

USA . 1,293 parts In-Stock

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$33.000

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1,293

$33.000

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Continental Prestige Electronics

USA . 6,548 parts In-Stock

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6,548

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Argo Parts USA

USA . 2,217 parts In-Stock

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2,217

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Corphita

USA . 2,103 parts In-Stock

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2,103

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DigiPath Technology Company

USA . 1,199 parts In-Stock

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$23.082

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1,199

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$23.082

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Bastille Electronics

Australia . 900 parts In-Stock

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900

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Overview

Discover the powerful PCA9557PWG4 by Texas Instruments, a top-of-the-line parallel I/O port that offers unmatched reliability and performance. With Texas Instruments' reputation for superior quality, this product is perfect for a wide range of applications in industrial settings. Unlock seamless integration and flexible functionality with 8 I/O lines, all while enjoying the benefits of a compact design and high-grade materials. Elevate your projects with the PCA9557PWG4 - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable makes the product easy to integrate onto PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage of 5.5V, the product can handle a wide range of power requirements without risk of damage.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of PCB real estate and easy placement within compact electronic devices.

No. of Bits: 8

Having 8 bits allows for more data transmission capability, making the product suitable for applications requiring parallel data transfer.

Power Supplies (V): 2.5/5

The dual power supply options of 2.5V and 5V provide flexibility in voltage compatibility for different system requirements.

No. of Terminals: 16

With 16 terminals, the product offers ample connection options for various input and output lines, enhancing connectivity and functionality.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage of 2.3V ensures compatibility with a wide range of power sources, making the product versatile in different power scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables the product to function effectively in harsh cold conditions, expanding its usability range.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in PCB layout and soldering options, accommodating different assembly preferences and requirements.

Maximum Seated Height: 1.2 mm

With a low maximum seated height of 1.2mm, the product is suitable for slim profile applications where space constraints are crucial.

Width: 4.4 mm

The compact width of 4.4mm allows for efficient space utilization on the PCB, especially in devices with limited board space.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature of 260°C ensures proper thermal management during solder reflow processes, preventing component damage.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can withstand high-temperature soldering processes without degradation, ensuring reliable assembly.

Length: 5 mm

The short length of 5mm contributes to the product's compact design, making it suitable for space-constrained applications without sacrificing functionality.

Temperature Grade: INDUSTRIAL

Being industrial-grade, the product is designed to withstand demanding operating conditions, making it reliable for use in industrial applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, the product offers versatile interfacing capabilities for a wide range of applications, making it a flexible choice for various projects.

Technology: CMOS

Utilizing CMOS technology allows for low power consumption, high noise immunity, and compatibility with a wide range of digital systems, enhancing overall performance.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and robust mechanical support, ensuring secure connections and reliable operation.

Nominal Supply Voltage: 2.5 V

With a nominal supply voltage of 2.5V, the product offers a stable operating voltage for reliable performance in various electronic systems.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65mm enables high-density mounting on the PCB, allowing for more terminals in a limited space and enhancing connectivity options.

No. of I/O Lines: 8

Having 8 I/O lines provides sufficient input and output channels for data transfer, making the product suitable for applications requiring multiple parallel connections.

Technical Specifications

Parallel I/O Ports PCA9557PWG4 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Parallel IO Ports

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

PCA9557PWG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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