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PCF8575DWG4

Texas Instruments

PCF8575DWG4 by Texas Instruments

PCF8575DWG4 by Texas Instruments is a 16-bit parallel I/O port with 2 ports, operating at a max clock frequency of 0.4 MHz. It has a supply voltage range of 2.5V to 5.5V and can handle industrial temperatures from -40°C to 85°C. Ideal for general purpose applications requiring CMOS technology and small outline packaging.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 5,531 parts In-Stock

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Digiode

USA . 359 parts In-Stock

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Nova Conductors

Japan . 84 parts In-Stock

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Semi Source

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One Stop Electronics

USA . 282 parts In-Stock

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AZTECH Wire

Italy . 443 parts In-Stock

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Semicontronic

India . 533 parts In-Stock

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$16.000

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$15.600

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$15.520

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Ampacity Inc.

Singapore . 602 parts In-Stock

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$29.000

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Parana Technologies

USA . 470 parts In-Stock

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DigiPath Technology Company

USA . 1,374 parts In-Stock

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ChromeModa Solutions

Germany . 3,465 parts In-Stock

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IDEA Electronic Components Group

UK . 1,848 parts In-Stock

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Corohmni

South Africa . 392 parts In-Stock

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Continental Prestige Electronics

USA . 4,574 parts In-Stock

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Argo Parts USA

USA . 2,336 parts In-Stock

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Corphita

USA . 2,126 parts In-Stock

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Perfect Parts

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Bastille Electronics

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Overview

Enhance your project with the high-quality PCF8575DWG4 by Texas Instruments, a top-tier manufacturer known for reliability and innovation. This Parallel I/O Ports device offers seamless integration and versatility in applications like data acquisition systems and industrial automation. With its compact design and superior performance, this product provides exceptional value and benefits to customers seeking efficiency and precision in their projects. Elevate your work with the cutting-edge technology of the PCF8575DWG4 and experience the advantages it brings to your endeavors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for the product, ensuring it can withstand various environmental conditions.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with various systems and devices that operate within this voltage range.

No. of Bits: 16

Provides a high level of data transfer and processing capabilities, suitable for applications requiring complex parallel I/O operations.

Maximum Operating Temperature: 85 °C

Ensures stable operation even in high-temperature environments, making it suitable for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish enhances conductivity and corrosion resistance, ensuring reliable connections for long-term use.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

No. of I/O Lines: 16

Having 16 I/O lines allows for versatile connectivity and data transfer capabilities, meeting the requirements of various applications.

Technical Specifications

Parallel I/O Ports PCF8575DWG4 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

Maximum Clock Frequency:

.4 MHz

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Parallel IO Ports

Maximum Supply Current:

.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

PCF8575DWG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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