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PCA9554RGTR

Texas Instruments

PCA9554RGTR by Texas Instruments

PCA9554RGTR by Texas Instruments is an 8-bit parallel I/O port with a supply voltage range of 2.3V to 5.5V, suitable for industrial applications. This CMOS technology chip carrier has 16 terminals and operates b/w -40°C to 85°C, making it ideal for general purpose use in compact electronic devices. With a terminal pitch of 0.5mm and no lead form, this IC offers versatile connectivity options in a small square package shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,393 parts In-Stock

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6,393

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Digiode

USA . 2,413 parts In-Stock

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2,413

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Distributors (Availability)

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AZTECH Wire

Italy . 454 parts In-Stock

1+ parts

$7.007

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454

$7.007

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One Stop Electronics

USA . 756 parts In-Stock

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$26.000

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756

$26.000

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Parana Technologies

USA . 1,771 parts In-Stock

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$29.149

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$56.050

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1,771

$29.149

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$56.050

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ChromeModa Solutions

Germany . 6,970 parts In-Stock

1+ parts

$32.752

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$26.857

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6,970

$32.752

$26.857

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IDEA Electronic Components Group

UK . 1,117 parts In-Stock

1+ parts

$32.752

100+ parts

$31.114

1k+ parts

$29.477

10k+ parts

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1,117

$32.752

$31.114

$29.477

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Corohmni

South Africa . 1,027 parts In-Stock

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$54.569

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1,027

$54.569

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Corphita

USA . 4,062 parts In-Stock

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DigiPath Technology Company

USA . 713 parts In-Stock

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$29.529

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713

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$29.529

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Overview

Enhance your projects with the high-quality PCA9554RGTR by Texas Instruments, a reliable manufacturer known for delivering top-notch electronic components. This Parallel I/O Ports device offers versatile applications and exceptional performance, making it a valuable addition to any design. With dual power supplies, 8 bits, and a compact square package, this product provides customers with efficient solutions for their projects. Trust in Texas Instruments for superior technology that brings innovation to your work.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact installation on a PCB, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5 V provides a wide operating range and flexibility in design.

Package Shape: SQUARE

The square package shape is compact and allows for efficient use of board space.

No. of Bits: 8

With 8 bits, this parallel I/O port can handle a variety of data inputs and outputs simultaneously, making it versatile for different applications.

Power Supplies (V): 2.5/5

Support for dual power supply voltages (2.5 V and 5 V) enhances compatibility with different systems and components.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and signals to be managed efficiently.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles offer flexibility in mounting options and thermal management, catering to various design requirements.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage of 2.3 V ensures efficient power consumption and operation in low voltage applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in challenging environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for use in a wide range of temperature conditions without compromising functionality.

Terminal Position: QUAD

The quad terminal position simplifies connections and layout on the PCB, easing the design and assembly process.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm enables a more compact overall design of the product.

Width: 3 mm

The narrow width of 3 mm contributes to the compactness and space-saving nature of the product.

Length: 3 mm

The short length of 3 mm further enhances the compact footprint of the product, ideal for constrained spaces.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can withstand harsh operating conditions typically found in industrial environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Being a general-purpose parallel I/O port allows for versatile use in various applications that require parallel interfacing and communication.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product efficient and reliable in operation.

Terminal Form: NO LEAD

The no-lead terminal form simplifies manufacturing processes and increases reliability by eliminating the risk of lead-related issues.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V is commonly used in many electronic systems, ensuring compatibility with standard voltage requirements.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting on the PCB, saving space and enabling compact designs.

No. of I/O Lines: 8

With 8 I/O lines, this product can handle multiple input and output signals simultaneously, offering versatility and flexibility in interfacing with other devices.

Technical Specifications

Parallel I/O Ports PCA9554RGTR attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

No. of Bits:

8

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Parallel IO Ports

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Peripheral IC Type:

Trade Compliance

PCA9554RGTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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