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SN74LS611FN

Texas Instruments

SN74LS611FN by Texas Instruments

SN74LS611FN by Texas Instruments is a TTL technology chip carrier with 44 terminals, operating b/w 0-70°C. It features 12 I/O lines, supports a supply voltage range of 4.75-5.25 V, and is ideal for parallel I/O port applications in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,713 parts In-Stock

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5,713

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Digiode

USA . 167 parts In-Stock

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167

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 549 parts In-Stock

1+ parts

$11.000

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549

$11.000

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AZTECH Wire

Italy . 736 parts In-Stock

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$17.197

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736

$17.197

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Parana Technologies

USA . 176 parts In-Stock

1+ parts

$23.118

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$23.754

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176

$23.118

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$23.754

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ChromeModa Solutions

Germany . 5,824 parts In-Stock

1+ parts

$25.975

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$21.300

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5,824

$25.975

$21.300

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IDEA Electronic Components Group

UK . 1,761 parts In-Stock

1+ parts

$25.975

100+ parts

$24.676

1k+ parts

$23.378

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1,761

$25.975

$24.676

$23.378

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Corohmni

South Africa . 717 parts In-Stock

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$66.195

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717

$66.195

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Corphita

USA . 4,322 parts In-Stock

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DigiPath Technology Company

USA . 814 parts In-Stock

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$23.419

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814

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$23.419

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Overview

Unlock the power of seamless data transfer with the SN74LS611FN from Texas Instruments. This versatile Parallel I/O Port chip carrier offers a wide range of applications, providing users with reliable and efficient performance. With Texas Instruments' reputation for quality and innovation, you can trust that this product exceeds industry standards. Say goodbye to connectivity issues and hello to smooth operation with the SN74LS611FN, delivering convenience and peace of mind to customers looking for a dependable solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product reliable and easy to handle.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 5.25 V

A high maximum supply voltage provides flexibility in power requirements and can handle a wide range of applications.

Package Shape: SQUARE

The square shape allows for efficient use of space on the PCB and easy alignment during installation.

No. of Terminals: 44

Having a high number of terminals provides versatility and allows for connection to multiple peripheral devices.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal and electrical performance, enhancing the overall functionality of the product.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this product can function effectively even in colder environments.

Technology: TTL

TTL technology provides fast response times and high noise immunity, making it ideal for parallel I/O applications that require reliability and speed.

No. of I/O Lines: 12

Having multiple I/O lines allows for efficient communication and data transfer between the device and external peripherals.

Technical Specifications

Parallel I/O Ports SN74LS611FN attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of I/O Lines:

12

No. of Ports:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC(UNSPEC)

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16.5862 mm

Peripheral IC Type:

Trade Compliance

SN74LS611FN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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