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SN74S412D3

Texas Instruments

SN74S412D3 by Texas Instruments

SN74S412D3 by Texas Instruments is an 8-bit parallel I/O port with CMOS technology. It comes in a small outline package with gull wing terminals and operates b/w 0°C to 70°C. Ideal for applications requiring precise data transfer and control, this device offers surface mount capability for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,580 parts In-Stock

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4,580

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Vyrian

USA . 2,065 parts In-Stock

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2,065

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 743 parts In-Stock

1+ parts

$10.309

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743

$10.309

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One Stop Electronics

USA . 1,220 parts In-Stock

1+ parts

$12.000

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1,220

$12.000

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Corohmni

South Africa . 235 parts In-Stock

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$35.467

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235

$35.467

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Parana Technologies

USA . 1,176 parts In-Stock

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$76.449

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1,176

$76.449

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ChromeModa Solutions

Germany . 786 parts In-Stock

1+ parts

$85.898

100+ parts

$70.436

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786

$85.898

$70.436

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IDEA Electronic Components Group

UK . 692 parts In-Stock

1+ parts

$85.898

100+ parts

$81.603

1k+ parts

$77.308

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692

$85.898

$81.603

$77.308

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Corphita

USA . 4,298 parts In-Stock

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DigiPath Technology Company

USA . 1,372 parts In-Stock

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$77.446

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1,372

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$77.446

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Overview

Unlock endless possibilities with the SN74S412D3 by Texas Instruments, a high-quality Parallel I/O Port designed for seamless integration and reliability. As a trusted manufacturer in the industry, Texas Instruments ensures top-notch performance and durability. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers looking for precision and efficiency in their projects. Experience the advantages of advanced technology and innovative design with the SN74S412D3 - where quality meets performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the parallel I/O ports, making them reliable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, these parallel I/O ports can withstand moderate heat levels, ensuring stable performance in various environments.

Technology: CMOS

The CMOS technology used in these parallel I/O ports offers low power consumption and high noise immunity, making them energy-efficient and reliable for data transfer.

Terminal Pitch: 1.27 mm

The narrow terminal pitch of 1.27 mm allows for precise and compact placement of the parallel I/O ports on circuit boards, maximizing space utilization and enabling high-density designs.

Technical Specifications

Parallel I/O Ports SN74S412D3 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

No. of Bits:

8

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Sub-Category:

Parallel IO Port

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74S412D3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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