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SN74LS613JD

Texas Instruments

SN74LS613JD by Texas Instruments

SN74LS613JD by Texas Instruments is a CMOS technology Parallel I/O Port IC with 12 I/O lines. It operates b/w 0-70°C, with supply voltage range of 4.75-5.25V. This IC is commonly used in commercial applications requiring general purpose parallel I/O functionality.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,046 parts In-Stock

1+ parts

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3,046

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Digiode

USA . 1,607 parts In-Stock

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1,607

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,368 parts In-Stock

1+ parts

$9.000

100+ parts

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1,368

$9.000

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AZTECH Wire

Italy . 195 parts In-Stock

1+ parts

$9.332

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195

$9.332

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Parana Technologies

USA . 847 parts In-Stock

1+ parts

$47.212

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847

$47.212

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Corohmni

South Africa . 641 parts In-Stock

1+ parts

$51.330

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641

$51.330

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IDEA Electronic Components Group

UK . 1,796 parts In-Stock

1+ parts

$53.047

100+ parts

$50.395

1k+ parts

$47.742

10k+ parts

-

1,796

$53.047

$50.395

$47.742

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ChromeModa Solutions

Germany . 407 parts In-Stock

1+ parts

$53.047

100+ parts

$43.499

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407

$53.047

$43.499

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Corphita

USA . 4,697 parts In-Stock

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4,697

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DigiPath Technology Company

USA . 2,058 parts In-Stock

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$47.827

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2,058

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$47.827

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Overview

Upgrade your electronic projects with the SN74LS613JD by Texas Instruments, a top-quality Parallel I/O Port that offers reliability and superior performance. With a durable ceramic and metal-sealed cofired body, this IC provides 12 I/O lines for versatile applications. Ideal for general purpose use, this product operates at a maximum supply voltage of 5.25V and a minimum of 4.75V, ensuring consistent functionality. Trust Texas Instruments for cutting-edge technology and experience seamless integration in your designs. Elevate your projects with the SN74LS613JD today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for compatibility with a wide range of devices and applications, providing flexibility for users.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate this product into existing setups or circuit designs without taking up too much space.

No. of Terminals: 40

With a high number of terminals, this product can support numerous connections and devices simultaneously, increasing its versatility.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows this product to function effectively in a wide range of environments, making it suitable for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable performance of the product.

No. of I/O Lines: 12

The 12 I/O lines enable the product to handle multiple input and output signals simultaneously, enhancing its functionality and versatility.

Technical Specifications

Parallel I/O Ports SN74LS613JD attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-CDIP-T40

No. of I/O Lines:

12

No. of Ports:

1

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SN74LS613JD Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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