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SN74LS612N

Texas Instruments

SN74LS612N by Texas Instruments

SN74LS612N by Texas Instruments is a TTL technology IC with 12 I/O lines, operating at 5V. It features a rectangular package style with 40 terminals and temperature range of 0-70°C. Ideal for parallel I/O port applications in commercial-grade environments.

Median Price

$6.075

Lifecycle Status

Suppliers In-Stock

35

In-Stock Inventory

1k+

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Rochester

USA . 5,966 parts In-Stock

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$4.860

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DigiKey

USA . 5,966 parts In-Stock

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Verical

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$5.438

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TEDSS.com

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Digiode

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Vyrian

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Freelance Electronics

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American Microsemiconductor Inc.

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Standard Data Resources

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Q Components

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Electronic Expediters

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Mentor Electronics Marketing, LLC

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Resion

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ACDS - Activité Composants Distribution Service

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LWI Electronics Inc

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Digital Electronic Gebert Verwaltungs UG

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Holdelec - ElecDif-Pro

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Inland Empire Components Inc.

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Odi Ramu Company

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J & M Industries LLC

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Manoshevitz Elec. Sales

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Bristol Electronics

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Pegasus Components GmbH

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Mil-Aero Solutions, Inc.

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Corphita

USA . 3,714 parts In-Stock

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$4.869

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Parana Technologies

USA . 1,011 parts In-Stock

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$26.748

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$2,483.963

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$24.073

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DigiPath Technology Company

USA . 422 parts In-Stock

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ChromeModa Solutions

Germany . 4,403 parts In-Stock

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IDEA Electronic Components Group

UK . 1,473 parts In-Stock

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Corohmni

South Africa . 5,144 parts In-Stock

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Infinite Electronics LLP (Excess)

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Kepictronics

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Overview

Unlock the power of seamless data transfer with the SN74LS612N by Texas Instruments. As a leader in semiconductor technology, Texas Instruments ensures top-notch quality and reliability in all their products, including the SN74LS612N Parallel I/O Ports. This versatile component is perfect for a wide range of applications, offering customers the value of speedy data transmission and easy integration. Say goodbye to compatibility issues and hello to efficiency with the SN74LS612N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to damage, making this product a long-lasting choice.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes this product compatible with many devices and systems.

No. of Terminals: 40

With 40 terminals, this product offers plenty of connectivity options, making it versatile for various applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows this product to perform reliably even in challenging environments.

Width: 15.24 mm

The compact width of 15.24mm makes this product suitable for applications where space is limited.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards and specifications for reliable performance.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

The general purpose parallel I/O port allows for flexible and versatile functionality, making this product suitable for a wide range of applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with various systems and devices.

No. of I/O Lines: 12

With 12 I/O lines, this product provides multiple input and output options for enhanced connectivity and functionality.

Technical Specifications

Parallel I/O Ports SN74LS612N attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T40

Length:

52.455 mm

No. of I/O Lines:

12

No. of Ports:

1

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Other Microprocessor ICs

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

SN74LS612N Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-314-6453, 5962013146453

NIIN

013146453

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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