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SN74S412NP1

Texas Instruments

SN74S412NP1 by Texas Instruments

SN74S412NP1 by Texas Instruments is an 8-bit Parallel I/O Port with CMOS technology. It features a rectangular package style with 24 terminals and operates b/w 0°C to 70°C. Ideal for commercial applications requiring precise data transfer in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,000

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Vyrian

USA . 2,702 parts In-Stock

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2,702

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,284 parts In-Stock

1+ parts

$4.000

100+ parts

-

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1,284

$4.000

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AZTECH Wire

Italy . 425 parts In-Stock

1+ parts

$14.063

100+ parts

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425

$14.063

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Parana Technologies

USA . 2,040 parts In-Stock

1+ parts

$17.201

100+ parts

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1k+ parts

$17.417

10k+ parts

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2,040

$17.201

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$17.417

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DigiPath Technology Company

USA . 384 parts In-Stock

1+ parts

$18.940

100+ parts

$17.425

1k+ parts

-

10k+ parts

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384

$18.940

$17.425

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ChromeModa Solutions

Germany . 2,859 parts In-Stock

1+ parts

$19.327

100+ parts

$15.848

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2,859

$19.327

$15.848

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IDEA Electronic Components Group

UK . 2,293 parts In-Stock

1+ parts

$19.327

100+ parts

$18.361

1k+ parts

$17.394

10k+ parts

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2,293

$19.327

$18.361

$17.394

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Corohmni

South Africa . 687 parts In-Stock

1+ parts

$24.053

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687

$24.053

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Corphita

USA . 3,873 parts In-Stock

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3,873

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Overview

Experience the unparalleled quality and reliability of the SN74S412NP1 Parallel I/O Port by Texas Instruments. This versatile component offers seamless integration and efficient data transfer, making it ideal for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product delivers exceptional performance and durability. Upgrade your projects with the SN74S412NP1 and unlock a world of possibilities with its advanced technology and user-friendly design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability, making the product suitable for long-term use.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices and PCB designs.

No. of Bits: 8

8-bit parallel I/O ports provide sufficient data transfer capabilities for many applications.

No. of Terminals: 24

Having 24 terminals allows for versatile connectivity options with other devices and components.

Package Style (Meter): IN-LINE

In-line package style ensures easy installation and space-efficient design.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures product reliability in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in colder environments without performance issues.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved connectivity reliability.

Temperature Grade: COMMERCIAL

Commercial temperature grade means the product is suitable for standard commercial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure secure and stable connections, ideal for robust and long-lasting applications.

Terminal Pitch: 2.54 mm

2.54 mm terminal pitch allows for easy soldering and board assembly, making the product user-friendly for manufacturers.

Technical Specifications

Parallel I/O Ports SN74S412NP1 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

No. of Bits:

8

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Parallel IO Port

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74S412NP1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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