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PCF8574AP,112

NXP Semiconductors

PCF8574AP,112 by NXP Semiconductors

PCF8574AP,112 by NXP Semiconductors is an 8-bit parallel I/O port with a supply voltage range of 2.5V to 6V and clock frequency up to 0.1MHz. Ideal for industrial applications, it features a temperature range from -40°C to 85°C and offers 8 I/O lines in a compact rectangular package style.

Median Price

$1.077

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 39 parts In-Stock

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$1.077

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39

$1.077

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Vyrian

USA . 5,099 parts In-Stock

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Anansix

USA . 1,802 parts In-Stock

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Digiode

USA . 186 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 105 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,204 parts In-Stock

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$1.077

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$1.055

4,204

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$1.055

Argo Parts USA

USA . 667 parts In-Stock

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$1.077

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Ampacity Inc.

Singapore . 1,094 parts In-Stock

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$7.000

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$7.000

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Microchip USA

USA . 401 parts In-Stock

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$11.721

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401

$11.721

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AZTECH Wire

Italy . 505 parts In-Stock

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$19.330

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$19.330

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One Stop Electronics

USA . 397 parts In-Stock

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$30.000

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Aztec Data Supply Inc.

USA . 1,302 parts In-Stock

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$31.350

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Corohmni

South Africa . 42 parts In-Stock

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$83.444

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Corphita

USA . 2,866 parts In-Stock

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UNI Independent Distributors

Spain . 2,076 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$1.055

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$1.023

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$1.002

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$1.002

Perfect Parts

USA . 235 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 105 parts In-Stock

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Glotronic Ltd.

UK . 84 parts In-Stock

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Overview

Unlock endless possibilities with the NXP Semiconductors PCF8574AP,112 Parallel I/O Ports. Crafted with precision and quality by a leading manufacturer in the industry, this versatile component offers unparalleled value to customers in a wide range of applications. Seamlessly integrate this product into your projects for enhanced functionality and efficiency. Experience the benefits of reliable performance, ease of use, and innovative design that sets this product apart from the rest. Elevate your creations with the PCF8574AP,112 and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while providing protection to internal components.

Maximum Supply Voltage: 6 V

With a high maximum supply voltage, this product can handle power inputs efficiently and safely within the specified range.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and space-saving in circuit designs.

No. of Bits: 8

Having 8 bits allows for handling a wide range of data and signals simultaneously, providing flexibility in data processing.

Power Supplies (V): 3/5

Support for multiple power supply voltages (3V and 5V) makes the product compatible with a variety of systems and devices.

No. of Terminals: 16

The higher number of terminals allows for more connections and interfaces, accommodating complex circuit configurations.

Package Style (Meter): IN-LINE

The in-line package style simplifies PCB layout and assembly, making it easier to integrate into electronic systems.

Minimum Supply Voltage: 2.5 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, enabling reliable performance in different environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising functionality, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to operate in cold environments, ensuring consistent performance in various conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity, corrosion resistance, and durability, ensuring reliable electrical connections for a prolonged lifespan.

Terminal Position: DUAL

Dual terminal positions offer flexibility in mounting and connection options, facilitating easier integration into circuit designs.

Maximum Seated Height: 4.2 mm

The compact seated height allows for a low-profile design, saving space in electronic devices and systems.

Width: 7.62 mm

The moderate width offers a balance between compactness and accessibility, making it suitable for various board design constraints.

Maximum Clock Frequency: 0.1 MHz

The maximum clock frequency of 0.1 MHz allows for efficient data transfer and processing speed within the specified limits.

Length: 19.025 mm

The length provides sufficient space for terminals and components, while still maintaining a compact form factor for easy integration.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments, making this product suitable for industrial applications and rugged use.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Being a general-purpose parallel I/O port, this product offers versatility and compatibility with a wide range of applications and systems.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology provides low power consumption, high noise immunity, and compatibility with various digital systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure secure connections and easy soldering during PCB assembly, enhancing the product's reliability and durability.

Maximum Supply Current: 0.1 mA

The low maximum supply current ensures energy efficiency and minimizes power consumption, making the product ideal for portable or battery-operated devices.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in many electronic systems, ensuring compatibility and ease of integration.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm enables easy connections, compatibility with standard components, and convenient PCB layout.

No. of I/O Lines: 8

Having 8 I/O lines provides sufficient input/output capabilities for handling data and interfacing with external devices efficiently.

Technical Specifications

Parallel I/O Ports PCF8574AP,112 attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

Maximum Clock Frequency:

.1 MHz

External Data Bus Width:

1

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.025 mm

No. of Bits:

8

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

Parallel IO Ports

Maximum Supply Current:

.1 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

PCF8574AP,112 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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