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PCF8575TS/1

NXP Semiconductors

PCF8575TS/1 by NXP Semiconductors

PCF8575TS/1 by NXP Semiconductors is a CMOS technology-based parallel I/O port with 16 I/O lines. It operates b/w -40 to 85 °C and supports supply voltage range of 2.5V to 5.5V. Widely used in industrial applications for interfacing with external devices due to its small outline package and dual terminal position.

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Digiode

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Lantek

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Nova Conductors

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Prism Electronics

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Semicontronic

India . 811 parts In-Stock

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$4.875

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AZTECH Wire

Italy . 196 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 1,081 parts In-Stock

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Aztec Data Supply Inc.

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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Corohmni

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Overview

Discover the ultimate solution for your parallel I/O port needs with NXP Semiconductors' PCF8575TS/1. This high-quality product offers a wide range of applications in various industries, providing reliable performance and versatility. With its durable plastic/epoxy body material and advanced technology, this device ensures seamless operation even in challenging environments. Experience the convenience and efficiency of 16 I/O lines, dual terminal position, and industrial temperature grade, making it the perfect choice for your next project. Upgrade your system with the PCF8575TS/1 and unlock endless possibilities for innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making this product a reliable choice.

Surface Mount: YES

The surface mount design allows for easy installation and space-saving on a PCB, ideal for compact electronic devices.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product is suitable for a wide range of applications requiring higher voltage levels.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standardized form factor, making it compatible with various other components and easy to integrate into designs.

No. of Terminals: 24

The ample number of terminals allows for versatile connectivity options, enabling the product to interface with multiple external devices.

Package Style: SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design save space on the PCB, allowing for more efficient layouts and compact product designs.

Minimum Supply Voltage: 2.5 V

The low minimum supply voltage ensures compatibility with lower voltage systems, offering flexibility in different operating environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated temperatures, ensuring reliable performance even in harsh conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in cold environments, expanding the product's versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold offers excellent conductivity and corrosion resistance, ensuring stable connections and longevity of the product.

Terminal Position: DUAL

Dual terminal positions provide redundancy and flexibility in connecting the product, enhancing reliability and ease of installation.

Maximum Seated Height: 2 mm

The low maximum seated height contributes to a slim profile, making this product suitable for applications with space constraints.

Width: 5.3 mm

The compact width of the product allows for efficient space utilization on the PCB, ideal for designs with limited real estate.

Maximum Time At Peak Reflow Temperature: 30s

The short maximum reflow time ensures quick and efficient assembly processes, reducing production time and costs.

Peak Reflow Temperature: 260C

The high peak reflow temperature capability enables reliable soldering, ensuring secure connections during manufacturing.

Length: 8.2 mm

The moderate length of the product offers a balanced form factor, suitable for various design requirements.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designation indicates that this product is suitable for rugged environments and demanding applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Designed as a general-purpose parallel IO port, this product offers versatility and compatibility for a wide range of applications.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and compatibility with modern electronic systems.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and easy soldering, ensuring reliable connections and robust performance.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for high-density mounting on the PCB, making this product suitable for compact designs with multiple components.

No. of I/O Lines: 16

With 16 I/O lines, this product offers ample connectivity options for interfacing with various external devices, enhancing its versatility.

Technical Specifications

Parallel I/O Ports PCF8575TS/1 attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

16

No. of Ports:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

PCF8575TS/1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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