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PCA9535DBG4

Texas Instruments

PCA9535DBG4 by Texas Instruments

PCA9535DBG4 by Texas Instruments is a 16-bit parallel I/O port with 2.3-5.5V supply voltage range, operating from -40 to 85°C. It features a 0.4 MHz clock frequency, ideal for industrial applications requiring general-purpose parallel I/O interfacing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,256 parts In-Stock

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5,256

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Digiode

USA . 2,932 parts In-Stock

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2,932

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Nova Conductors

Japan . 78 parts In-Stock

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78

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One Stop Electronics

USA . 1,007 parts In-Stock

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$10.000

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1,007

$10.000

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AZTECH Wire

Italy . 388 parts In-Stock

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$14.159

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388

$14.159

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Ampacity Inc.

Singapore . 1,529 parts In-Stock

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$33.000

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1,529

$33.000

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Parana Technologies

USA . 999 parts In-Stock

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$47.935

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999

$47.935

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DigiPath Technology Company

USA . 2,284 parts In-Stock

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$52.782

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2,284

$52.782

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ChromeModa Solutions

Germany . 4,823 parts In-Stock

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$53.859

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$44.164

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4,823

$53.859

$44.164

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IDEA Electronic Components Group

UK . 59 parts In-Stock

1+ parts

$53.859

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$51.166

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$48.473

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59

$53.859

$51.166

$48.473

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Corohmni

South Africa . 3,247 parts In-Stock

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$74.772

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Corphita

USA . 2,477 parts In-Stock

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2,477

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Unlock endless possibilities with the PCA9535DBG4 by Texas Instruments, a cutting-edge Parallel I/O Port that offers unparalleled quality and reliability. Designed with precision by Texas Instruments, this versatile component caters to a wide range of applications, providing seamless integration and exceptional performance. Experience the value and benefits of this innovative product, with its advanced technology and industrial-grade construction ensuring optimal functionality in every use. Trust Texas Instruments to deliver excellence, and elevate your projects with the PCA9535DBG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection to the internal components, making the product reliable for long-term use.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the product can withstand a wide range of environmental conditions, making it suitable for industrial applications.

No. of Bits: 16

With 16 bits, this parallel I/O port offers high data transfer capabilities, making it ideal for applications that require handling large amounts of data simultaneously.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Maximum Clock Frequency: 0.4 MHz

The high maximum clock frequency allows for fast data processing and communication, making the product suitable for high-speed applications.

Technical Specifications

Parallel I/O Ports PCA9535DBG4 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

Maximum Clock Frequency:

.4 MHz

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Parallel IO Ports

Maximum Supply Current:

.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

PCA9535DBG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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