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NSC810AE/883

Texas Instruments

NSC810AE/883 by Texas Instruments

NSC810AE/883 by Texas Instruments is a 16-bit Parallel I/O Port with CMOS technology. It operates at -55 to 125°C, suitable for military applications. With 3 ports and 2 timers, it has a supply voltage of 5V and max current of 10mA in a ceramic chip carrier package.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,329 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 209 parts In-Stock

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One Stop Electronics

USA . 198 parts In-Stock

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Parana Technologies

USA . 1,401 parts In-Stock

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DigiPath Technology Company

USA . 1,845 parts In-Stock

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ChromeModa Solutions

Germany . 207 parts In-Stock

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IDEA Electronic Components Group

UK . 95 parts In-Stock

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Corohmni

South Africa . 966 parts In-Stock

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Corphita

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Overview

Looking for a high-quality Parallel I/O Port solution? Look no further than the NSC810AE/883 by Texas Instruments. With military-grade screening and ceramic package body material, this chip carrier offers 16 bits of power at 5V, perfect for a wide range of applications. From industrial automation to aerospace, this CMOS technology device provides reliable performance in extreme temperatures. Trust Texas Instruments to deliver innovative solutions that meet your needs. Upgrade your system with the NSC810AE/883 today!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent durability and thermal conductivity, making this product suitable for rugged environments and high-temperature applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and facilitating automated assembly processes.

Screening Level: 38535Q/M; 38534H; 883B

High screening levels ensure reliability and quality, meeting stringent military standards for performance and durability.

No. of Bits: 16

16-bit parallel I/O ports provide ample data transfer capability, enabling efficient communication between the product and external devices.

Power Supplies (V): 5

Operating at a standard 5V power supply voltage simplifies compatibility and integration with existing systems.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers compact size and robust protection for the internal components, ideal for space-constrained applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range ensures reliable performance in extreme environmental conditions without risk of overheating.

CPU Family: NSC800

Compatibility with the NSC800 CPU family ensures seamless integration with specific processors, enhancing overall system efficiency.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for reliable operation in cold environments without risk of malfunctions or performance degradation.

Terminal Position: QUAD

Quad terminal position provides easy connectivity and integration with external devices, simplifying setup and maintenance processes.

No. of Ports: 3

Having three ports enables simultaneous communication with multiple external devices, increasing overall data transfer efficiency and system flexibility.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliable performance in harsh environmental conditions and critical applications where failure is not an option.

No. of Timers: 2

Inclusion of two timers enhances the product's capability to schedule and manage time-sensitive operations, improving overall system performance and accuracy.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy electronic environments.

Terminal Form: J BEND

J bend terminal form facilitates secure and reliable connections with external devices, reducing the risk of loose connections or signal interference.

Maximum Supply Current: 10 mA

Low maximum supply current requirement conserves power and reduces operating costs, especially in battery-powered or energy-conscious applications.

Nominal Supply Voltage: 5 V

Operating at a standard 5V nominal supply voltage ensures compatibility with various systems and reduces the need for additional power conversion components.

Memory Organization: 128X8

Memory organization of 128x8 allows for efficient storage and retrieval of data, enhancing overall system performance and responsiveness.

Technical Specifications

Parallel I/O Ports NSC810AE/883 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

CPU Family:

NSC800

Memory Organization:

128X8

No. of Bits:

16

No. of Ports:

3

No. of Timers:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LDCC(UNSPEC)

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Parallel IO Port

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

NSC810AE/883 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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