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PCA9539DGVR

Texas Instruments

PCA9539DGVR by Texas Instruments

PCA9539DGVR by Texas Instruments is a 16-bit parallel I/O port with 2.5/5V power supplies, operating from -40 to 85°C. It features a small outline package with 24 terminals and dual terminal position for industrial applications requiring general-purpose parallel I/O functionality at a clock frequency of up to 0.4MHz.

Median Price

$2.092

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 200 parts In-Stock

1+ parts

$2.120

100+ parts

$1.930

1k+ parts

$1.800

10k+ parts

-

200

$2.120

$1.930

$1.800

-

Rochester

USA . 14,071 parts In-Stock

1+ parts

-

100+ parts

$1.840

1k+ parts

$1.650

10k+ parts

$1.550

14,071

-

$1.840

$1.650

$1.550

DigiKey

USA . 14,071 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.420

10k+ parts

-

14,071

-

-

$2.420

-

Verical

USA . 11,271 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.063

10k+ parts

$1.938

11,271

-

-

$2.063

$1.938

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,945 parts In-Stock

1+ parts

$0.998

100+ parts

-

1k+ parts

-

10k+ parts

-

4,945

$0.998

-

-

-

Nova Conductors

Japan . 56 parts In-Stock

1+ parts

$1.044

100+ parts

-

1k+ parts

-

10k+ parts

-

56

$1.044

-

-

-

Vyrian

USA . 13,398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,398

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 13,943 parts In-Stock

1+ parts

$0.890

100+ parts

-

1k+ parts

-

10k+ parts

-

13,943

$0.890

-

-

-

Semicontronic

India . 13,931 parts In-Stock

1+ parts

$0.890

100+ parts

$0.868

1k+ parts

$0.863

10k+ parts

-

13,931

$0.890

$0.868

$0.863

-

Corphita

USA . 2,640 parts In-Stock

1+ parts

$0.945

100+ parts

-

1k+ parts

-

10k+ parts

-

2,640

$0.945

-

-

-

Corohmni

South Africa . 354 parts In-Stock

1+ parts

$1.044

100+ parts

-

1k+ parts

-

10k+ parts

-

354

$1.044

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.044

100+ parts

-

1k+ parts

$0.992

10k+ parts

$0.971

2,000

$1.044

-

$0.992

$0.971

Continental Prestige Electronics

USA . 320 parts In-Stock

1+ parts

$1.044

100+ parts

-

1k+ parts

-

10k+ parts

$1.024

320

$1.044

-

-

$1.024

Argo Parts USA

USA . 53 parts In-Stock

1+ parts

$1.044

100+ parts

-

1k+ parts

-

10k+ parts

-

53

$1.044

-

-

-

Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$1.212

100+ parts

$1.115

1k+ parts

$1.044

10k+ parts

-

70

$1.212

$1.115

$1.044

-

Parana Technologies

USA . 1,257 parts In-Stock

1+ parts

$22.765

100+ parts

-

1k+ parts

$23.431

10k+ parts

-

1,257

$22.765

-

$23.431

-

DigiPath Technology Company

USA . 1,699 parts In-Stock

1+ parts

$25.067

100+ parts

-

1k+ parts

-

10k+ parts

-

1,699

$25.067

-

-

-

IDEA Electronic Components Group

UK . 202 parts In-Stock

1+ parts

$25.579

100+ parts

$24.300

1k+ parts

$23.021

10k+ parts

-

202

$25.579

$24.300

$23.021

-

ChromeModa Solutions

Germany . 85 parts In-Stock

1+ parts

$25.579

100+ parts

$20.975

1k+ parts

-

10k+ parts

-

85

$25.579

$20.975

-

-

Perfect Parts

USA . 2,878 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,878

-

-

-

-

Overview

Enhance your electronic designs with the high-quality PCA9539DGVR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products like this parallel I/O port that offers versatile applications and reliable performance. With its small outline and thin profile package style, this device provides customers with ease of use and flexibility in various projects. Experience the benefits of the PCA9539DGVR such as its industrial-grade temperature range, low power consumption, and dual terminal position. Upgrade your projects today with this exceptional product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and cost-effectiveness for the product.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 5.5 V

Ability to handle high supply voltages, providing flexibility in usage.

Address Bus Width: 4

Address bus width of 4 allows for efficient communication with peripheral devices.

Package Shape: RECTANGULAR

Rectangular shape provides versatility in PCB layout.

No. of Bits: 16

16-bit capability enables handling of larger data sets.

Power Supplies (V): 2.5/5

Support for multiple power supply voltages enhances compatibility with different systems.

No. of Terminals: 24

Ample terminals for connectivity with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and slim design saves space on the PCB.

Minimum Supply Voltage: 2.3 V

Can operate at lower supply voltages for energy efficiency.

Maximum Operating Temperature: 85 °C

High operating temperature range suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in various environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish for reliable connections.

Terminal Position: DUAL

Dual terminal position for added stability and durability.

No. of Ports: 2

Multiple ports for increased connectivity options.

Maximum Seated Height: 1.2 mm

Low seated height for space-saving installation.

Width: 4.4 mm

Compact width for efficient use of PCB space.

Maximum Clock Frequency: 0.4 MHz

High clock frequency for fast data transfer.

Peak Reflow Temperature °C: 260

High peak reflow temperature for robust soldering.

Length: 5 mm

Compact length for space-saving design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliability in harsh conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General-purpose peripheral IC for versatile use.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering.

Maximum Supply Current: 0.2 mA

Low supply current for energy efficiency.

Nominal Supply Voltage: 3 V

Standard nominal supply voltage for compatibility with various systems.

Terminal Pitch: 0.4 mm

Fine terminal pitch for compact PCB layout.

No. of I/O Lines: 16

16 I/O lines for versatile connectivity and data transfer.

Technical Specifications

Parallel I/O Ports PCA9539DGVR attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

.4 MHz

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Parallel IO Port

Maximum Supply Current:

.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

PCA9539DGVR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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