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NSC810AN-1

Texas Instruments

NSC810AN-1 by Texas Instruments

NSC810AN-1 by Texas Instruments is a 16-bit Parallel I/O Port with 40 terminals, operating at 5V. It features CMOS technology, suitable for NSC800 CPU family applications. The package style is in-line, with a temperature range of 0-70°C, making it ideal for commercial-grade projects.

Median Price

$37.210

Lifecycle Status

Suppliers In-Stock

8

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1k+

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American Microsemiconductor Inc.

USA . 3 parts In-Stock

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Vyrian

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Digiode

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Anansix

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ComSIT Distribution GmbH

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ComSIT USA

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Q Components

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J & M Industries LLC

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AZTECH Wire

Italy . 476 parts In-Stock

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One Stop Electronics

USA . 1,007 parts In-Stock

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Corohmni

South Africa . 1,889 parts In-Stock

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Parana Technologies

USA . 865 parts In-Stock

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DigiPath Technology Company

USA . 952 parts In-Stock

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ChromeModa Solutions

Germany . 3,512 parts In-Stock

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IDEA Electronic Components Group

UK . 1,025 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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Infinite Electronics LLP (Excess)

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Overview

Enhance your electronic projects with the NSC810AN-1 by Texas Instruments, a top-quality Parallel I/O Ports component that offers unmatched performance and reliability. Manufactured by Texas Instruments, known for its cutting-edge technology and innovative solutions, this product is perfect for a wide range of applications. With 16 bits and 3 ports, it provides exceptional value and benefits to customers looking to elevate their designs. Trust in Texas Instruments for superior quality and explore the endless possibilities with the NSC810AN-1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer good durability and protection for the internal components of the device.

No. of Bits: 16

Having 16 bits allows for high data processing capabilities, making this product suitable for applications requiring complex parallel I/O operations.

Power Supplies (V): 5

Operating at 5 volts ensures compatibility with many standard power sources, providing ease of integration into various systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand moderate heat levels during operation, increasing its reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the device energy-efficient and reliable in noisy environments.

Memory Organization: 128X8

The memory organization of 128x8 allows for efficient storage and retrieval of data, enhancing the overall performance of the device.

Technical Specifications

Parallel I/O Ports NSC810AN-1 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

CPU Family:

NSC800

JESD-30 Code:

R-PDIP-T40

Memory Organization:

128X8

No. of Bits:

16

No. of Ports:

3

No. of Terminals:

40

No. of Timers:

2

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Parallel IO Port

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

NSC810AN-1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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