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NSC810AV-4I

Texas Instruments

NSC810AV-4I by Texas Instruments

NSC810AV-4I by Texas Instruments is a 16-bit parallel I/O port chip carrier with CMOS technology. Operating at temperatures from -40 to 85°C, it has 3 ports and 2 timers, ideal for industrial applications. With a supply voltage of 5V and max current of 10mA, it offers reliable performance in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 3,963 parts In-Stock

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Vyrian

USA . 3,620 parts In-Stock

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Anansix

USA . 2,404 parts In-Stock

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2,404

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Distributors (Availability)

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AZTECH Wire

Italy . 846 parts In-Stock

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$8.926

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846

$8.926

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One Stop Electronics

USA . 930 parts In-Stock

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$19.000

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930

$19.000

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Corohmni

South Africa . 455 parts In-Stock

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$35.473

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455

$35.473

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Parana Technologies

USA . 551 parts In-Stock

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$35.733

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551

$35.733

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DigiPath Technology Company

USA . 660 parts In-Stock

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$39.346

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$36.198

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660

$39.346

$36.198

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ChromeModa Solutions

Germany . 4,838 parts In-Stock

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$40.149

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$32.922

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$40.149

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IDEA Electronic Components Group

UK . 1,060 parts In-Stock

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$40.149

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$38.142

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$36.134

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1,060

$40.149

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$36.134

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Corphita

USA . 929 parts In-Stock

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Assy Fe

Spain . 2 parts In-Stock

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Overview

Enhance your electronic projects with the NSC810AV-4I by Texas Instruments! This parallel I/O port provides 16 bits of power in a convenient chip carrier package, making it ideal for industrial-grade applications. With a reliable manufacturer like Texas Instruments behind it, this product offers high-quality performance and durability. Upgrade your designs with the NSC810AV-4I and experience seamless integration, efficient operation, and unparalleled value for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and heat resistant material ensures the product can withstand harsh operating conditions.

Surface Mount: YES

Easy to integrate onto circuit boards, saving space and simplifying assembly processes.

No. of Bits: 16

High number of bits allows for efficient data transfer and processing.

Power Supplies (V): 5

Operates at a commonly used voltage, making it compatible with a wide range of systems.

Package Style (Meter): CHIP CARRIER

Compact package style enables the product to be used in space-constrained applications.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without performance degradation, suitable for industrial environments.

CPU Family: NSC800

Specifically designed to work efficiently with NSC800 CPUs, ensuring seamless integration and compatibility.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold conditions, making it versatile for various environments.

Terminal Position: QUAD

Quad terminal position allows for multiple ports to be used simultaneously, increasing flexibility.

No. of Ports: 3

Multiple ports provide options for connectivity and data transfer, enhancing functionality.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliability and performance in demanding settings.

No. of Timers: 2

Includes timers for precise timing functions, adding functionality to the product.

Technology: CMOS

CMOS technology offers low power consumption and high speed, enhancing efficiency.

Terminal Form: J BEND

J Bend terminals provide secure connections and easy installation on circuit boards.

Maximum Supply Current: 10 mA

Low supply current consumption for energy efficiency and reduced heat generation.

Nominal Supply Voltage: 5 V

Operates at a standard voltage, ensuring compatibility with various systems and power sources.

Memory Organization: 128X8

Efficient memory organization for storing and processing data effectively.

Technical Specifications

Parallel I/O Ports NSC810AV-4I attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

CPU Family:

NSC800

Memory Organization:

128X8

No. of Bits:

16

No. of Ports:

3

No. of Timers:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC(UNSPEC)

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Parallel IO Port

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

NSC810AV-4I Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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