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PCF8574ATS/F3,118

NXP Semiconductors

PCF8574ATS/F3,118 by NXP Semiconductors

NXP Semiconductors' PCF8574ATS/F3,118 is a CMOS technology-based Parallel I/O Port IC with 8 I/O lines. It operates b/w -40 to 85 °C and supports supply voltage range of 2.5V to 6V. Ideal for industrial applications requiring general-purpose parallel I/O interfacing in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 3,491 parts In-Stock

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Anansix

USA . 1,721 parts In-Stock

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Vyrian

USA . 1,204 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Ampacity Inc.

Singapore . 472 parts In-Stock

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$2.000

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AZTECH Wire

Italy . 282 parts In-Stock

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One Stop Electronics

USA . 967 parts In-Stock

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Semicontronic

India . 1,370 parts In-Stock

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$30.225

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$30.070

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Aztec Data Supply Inc.

USA . 597 parts In-Stock

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$53.140

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Corohmni

South Africa . 215 parts In-Stock

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UNI Independent Distributors

Spain . 3,979 parts In-Stock

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Continental Prestige Electronics

USA . 3,972 parts In-Stock

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Corphita

USA . 498 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 80 parts In-Stock

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Overview

Enhance your electronic projects with the PCF8574ATS/F3,118 by NXP Semiconductors, a reliable Parallel I/O Port solution that offers seamless integration and superior performance. NXP Semiconductors is known for its top-notch quality and cutting-edge technology, making this product a must-have for a wide range of applications. From industrial automation to consumer electronics, this versatile component delivers unmatched value and efficiency, providing customers with endless possibilities for innovation. Elevate your designs with the PCF8574ATS/F3,118 and experience the benefits of precision engineering at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy installation and integration into various electronic devices.

Maximum Supply Voltage: 6 V

The high maximum supply voltage of 6V allows for compatibility with a wide range of systems and applications.

Package Shape: RECTANGULAR

Rectangular shape provides easy handling and integration into electronic circuit designs.

No. of Terminals: 20

With 20 terminals, this product offers ample I/O connections for versatile usage.

Package Style: SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact size and low profile design make it suitable for space-constrained applications.

Minimum Supply Voltage: 2.5 V

The low minimum supply voltage of 2.5V ensures energy efficiency and compatibility with lower power systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions without compromising performance.

Terminal Position: DUAL

Dual terminal position provides flexibility in installation and ensures secure connections.

Maximum Seated Height: 1.5 mm

Low seated height makes it suitable for compact device designs and improves overall aesthetics.

Width: 4.4 mm

Narrow width allows for efficient use of PCB space and enables compact circuit designs.

Length: 6.5 mm

Short length makes it suitable for space-constrained applications and compact electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General purpose parallel I/O port allows for versatile use in a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and fast switching speeds for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and easy soldering for reliable connections.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is commonly used in electronic systems, ensuring compatibility with most devices.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm allows for high-density I/O connections and compact PCB designs.

No. of I/O Lines: 8

8 I/O lines offer sufficient connectivity for general purpose parallel I/O operations.

Technical Specifications

Parallel I/O Ports PCF8574ATS/F3,118 attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

PCF8574ATS/F3,118 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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