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NSC810AD-4/883

Texas Instruments

NSC810AD-4/883 by Texas Instruments

NSC810AD-4/883 by Texas Instruments is a 16-bit Parallel I/O Port with 5V supply, MILITARY grade for NSC800 CPU family. It has 3 ports, 2 timers, and operates b/w -55 to 125 °C. Suitable for applications requiring high reliability in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,785 parts In-Stock

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Vyrian

USA . 4,405 parts In-Stock

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Anansix

USA . 1,050 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 774 parts In-Stock

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$9.820

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774

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One Stop Electronics

USA . 376 parts In-Stock

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$20.000

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Corohmni

South Africa . 26 parts In-Stock

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$36.959

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Parana Technologies

USA . 2,205 parts In-Stock

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$67.938

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$67.938

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DigiPath Technology Company

USA . 1,201 parts In-Stock

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$74.808

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$68.824

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IDEA Electronic Components Group

UK . 1,516 parts In-Stock

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$76.335

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$72.518

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$68.702

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ChromeModa Solutions

Germany . 556 parts In-Stock

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$76.335

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$62.595

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Corphita

USA . 5,262 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the NSC810AD-4/883 by Texas Instruments. Designed to deliver top-notch performance, this Parallel I/O Ports device is built with precision and expertise. With military-grade quality and durability, this product offers seamless integration for a wide range of applications. Elevate your projects with the unmatched value, benefits, and advantages that only Texas Instruments can provide. Upgrade to the NSC810AD-4/883 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC

The use of ceramic material provides durability and stability to the package, ensuring reliable performance even in harsh environments.

No. of Bits: 16

With 16 bits, this product offers a high level of data processing capability, suitable for handling complex parallel I/O operations efficiently.

Power Supplies (V): 5

Operating at a standard voltage of 5V, this product ensures compatibility with a wide range of systems and devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance even in elevated temperature environments, making it ideal for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Parallel I/O Ports NSC810AD-4/883 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

CPU Family:

NSC800

JESD-30 Code:

R-XDIP-T40

Memory Organization:

128X8

No. of Bits:

16

No. of Ports:

3

No. of Terminals:

40

No. of Timers:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Parallel IO Port

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

NSC810AD-4/883 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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