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SN74S412JP4

Texas Instruments

SN74S412JP4 by Texas Instruments

Texas Instruments' SN74S412JP4 is an 8-bit Parallel I/O Port IC with CMOS technology. It features a CERAMIC RECTANGULAR package style, 24 terminals on a DUAL position, and operates b/w 0°C to 70°C. Ideal for commercial applications requiring precise data transfer and control functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,805 parts In-Stock

1+ parts

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7,805

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Digiode

USA . 1,420 parts In-Stock

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1,420

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 324 parts In-Stock

1+ parts

$8.147

100+ parts

-

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324

$8.147

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One Stop Electronics

USA . 266 parts In-Stock

1+ parts

$35.000

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-

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266

$35.000

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Corohmni

South Africa . 770 parts In-Stock

1+ parts

$55.962

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770

$55.962

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Parana Technologies

USA . 736 parts In-Stock

1+ parts

$71.422

100+ parts

$6,632.580

1k+ parts

$64.279

10k+ parts

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736

$71.422

$6,632.580

$64.279

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DigiPath Technology Company

USA . 2,052 parts In-Stock

1+ parts

$78.644

100+ parts

$72.352

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2,052

$78.644

$72.352

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ChromeModa Solutions

Germany . 4,044 parts In-Stock

1+ parts

$80.249

100+ parts

$65.804

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4,044

$80.249

$65.804

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IDEA Electronic Components Group

UK . 108 parts In-Stock

1+ parts

$80.249

100+ parts

$76.237

1k+ parts

$72.224

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108

$80.249

$76.237

$72.224

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Corphita

USA . 1,335 parts In-Stock

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1,335

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Overview

Upgrade your electronics with the reliable SN74S412JP4 from Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Parallel I/O Ports like this one, designed to enhance your circuitry with precision and efficiency. With its durable ceramic package and advanced CMOS technology, this component offers superior performance and reliability in a wide range of applications. Trust Texas Instruments for cutting-edge solutions that elevate your projects to the next level. Upgrade today and experience the difference!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and insulation, making this product highly durable and reliable in various operating conditions.

No. of Bits: 8

Having 8 bits allows for a wide range of data transfer capabilities, making this product suitable for applications that require moderate data processing.

No. of Terminals: 24

With 24 terminals, this product offers flexibility in connecting to multiple devices or peripherals, enhancing its usability in complex systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures that this product can perform reliably even in hot environments without any risk of overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Technical Specifications

Parallel I/O Ports SN74S412JP4 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T24

No. of Bits:

8

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Sub-Category:

Parallel IO Port

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74S412JP4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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