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MAX7311AAG

NXP Semiconductors

MAX7311AAG by NXP Semiconductors

Parallel IO Ports; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

MAX7311AAG by NXP Semiconductors
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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 6,256 parts In-Stock

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Vyrian

USA . 4,601 parts In-Stock

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Anansix

USA . 2,574 parts In-Stock

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2,574

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Prism Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

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Semicontronic

India . 199 parts In-Stock

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$1.000

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$0.975

1k+ parts

$0.970

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199

$1.000

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$0.970

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Component Stockers USA

USA . 1,141 parts In-Stock

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$7.250

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$4.350

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$4.350

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MARBEL Systems

Belgium . 45 parts In-Stock

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$25.180

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$25.180

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Ampacity Inc.

Singapore . 1,325 parts In-Stock

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$28.000

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$28.000

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Texas Native Microelectronics

USA . 75 parts In-Stock

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$28.942

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$25.469

75

$28.942

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$25.469

One Stop Electronics

USA . 2,926 parts In-Stock

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$32.000

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2,926

$32.000

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Corohmni

South Africa . 5,247 parts In-Stock

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$33.990

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Kenton Components

USA . 2,208 parts In-Stock

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$34.730

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$30.563

2,208

$34.730

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$30.563

Qasali Group International

UK . 1,080 parts In-Stock

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$78.143

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$68.766

1,080

$78.143

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$68.766

A-Z Elektronik GmbH

Germany . 7,114 parts In-Stock

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UNI Independent Distributors

Spain . 6,366 parts In-Stock

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Continental Prestige Electronics

USA . 2,546 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 1,629 parts In-Stock

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1,629

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Argo Parts USA

USA . 604 parts In-Stock

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604

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Technical Specifications

Parallel I/O Ports MAX7311AAG attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

No. of Bits:

16

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2/5.5

Qualification:

Not Qualified

Sub-Category:

Parallel IO Port

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

MAX7311AAG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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