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PCF8575CTS/1,112

NXP Semiconductors

PCF8575CTS/1,112 by NXP Semiconductors

PCF8575CTS/1,112 by NXP Semiconductors is a 16-bit parallel I/O port with 2 ports and 16 I/O lines. It operates b/w -40 to 85°C, with supply voltage ranging from 4.5V to 5.5V. Widely used in industrial applications for general purpose interfacing due to its CMOS technology and small form factor.

Median Price

$1.080

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 321 parts In-Stock

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$1.080

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$1.060

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$1.040

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321

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Digiode

USA . 3,489 parts In-Stock

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Vyrian

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Anansix

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Bristol Electronics

USA . 483 parts In-Stock

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Euro-Tech

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Nova Conductors

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One Stop Electronics

USA . 402 parts In-Stock

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Microchip USA

USA . 457 parts In-Stock

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Corohmni

South Africa . 573 parts In-Stock

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AZTECH Wire

Italy . 488 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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UNI Independent Distributors

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Corphita

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Perfect Parts

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Aranea Global

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Overview

Discover the innovative PCF8575CTS/1,112 by NXP Semiconductors, a high-quality Parallel I/O Port that offers unparalleled versatility and reliability. With its advanced technology, this product is designed to meet industrial-grade standards, making it ideal for a wide range of applications. From automation to control systems, the PCF8575CTS/1,112 is the perfect solution for your project needs. Experience the benefits of seamless integration, efficient performance, and exceptional value with this cutting-edge component. Elevate your designs with NXP Semiconductors and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durable and reliable packaging for the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages for flexibility in different applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of PCB space.

No. of Bits: 16

16-bit parallel I/O ports provide high data transfer capabilities.

Power Supplies (V): 5

Operating at a commonly used supply voltage of 5V.

No. of Terminals: 24

Provides ample connectivity options for various external devices.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact package style with shrink pitch for efficient board layout.

Minimum Supply Voltage: 4.5 V

Supports lower supply voltages for energy-efficient operation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature for reliability in harsh environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range for versatile use cases.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable terminal finish for long-term reliability.

Terminal Position: DUAL

Dual terminal position for enhanced connectivity options.

No. of Ports: 2

Multiple ports provide versatility in connecting external devices.

Maximum Seated Height: 2 mm

Low seated height for compact PCB designs.

Width: 5.3 mm

Narrow width for efficient board space utilization.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable soldering during assembly.

Length: 8.2 mm

Compact length for space-saving PCB layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General-purpose parallel I/O port for versatile applications.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable connections.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V for stable operation.

Terminal Pitch: 0.65 mm

Fine terminal pitch for compact board layout.

No. of I/O Lines: 16

16 I/O lines for extensive connectivity options.

Technical Specifications

Parallel I/O Ports PCF8575CTS/1,112 attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

PCF8575CTS/1,112 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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