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STMPE1600QTR

STMicroelectronics

STMPE1600QTR by STMicroelectronics

STMPE1600QTR by STMicroelectronics is a 16-bit Parallel I/O Port with 1.8/3.3V power supplies, -40 to 85°C operating temp, and 0.5mm terminal pitch. It's used in industrial applications requiring general purpose parallel I/O interfacing in compact spaces due to its small form factor (4x4mm) and low seated height (1mm).

Median Price

$1.007

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.007

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$1.007

-

-

-

Vyrian

USA . 9,382 parts In-Stock

1+ parts

-

100+ parts

-

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-

9,382

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Cyclops Electronics Ltd

UK . 7,953 parts In-Stock

1+ parts

-

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7,953

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-

-

-

Chip Stock

USA . 4,268 parts In-Stock

1+ parts

-

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4,268

-

-

-

-

Digiode

USA . 3,221 parts In-Stock

1+ parts

-

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3,221

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-

-

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Anansix

USA . 2,513 parts In-Stock

1+ parts

-

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2,513

-

-

-

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Martec Srl

Italy . 254 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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254

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,442 parts In-Stock

1+ parts

$1.007

100+ parts

-

1k+ parts

-

10k+ parts

$0.987

4,442

$1.007

-

-

$0.987

Argo Parts USA

USA . 2,040 parts In-Stock

1+ parts

$1.007

100+ parts

-

1k+ parts

-

10k+ parts

-

2,040

$1.007

-

-

-

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$1.007

100+ parts

$0.957

1k+ parts

$0.909

10k+ parts

$0.896

100

$1.007

$0.957

$0.909

$0.896

Microchip USA

USA . 284 parts In-Stock

1+ parts

$14.326

100+ parts

-

1k+ parts

-

10k+ parts

-

284

$14.326

-

-

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AZTECH Wire

Italy . 497 parts In-Stock

1+ parts

$14.347

100+ parts

-

1k+ parts

-

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497

$14.347

-

-

-

Corohmni

South Africa . 674 parts In-Stock

1+ parts

$15.946

100+ parts

-

1k+ parts

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10k+ parts

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674

$15.946

-

-

-

Ampacity Inc.

Singapore . 875 parts In-Stock

1+ parts

$19.000

100+ parts

-

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875

$19.000

-

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IDEA Electronic Components Group

UK . 210 parts In-Stock

1+ parts

$21.727

100+ parts

-

1k+ parts

$19.554

10k+ parts

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210

$21.727

-

$19.554

-

Aztec Data Supply Inc.

USA . 142 parts In-Stock

1+ parts

$31.010

100+ parts

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142

$31.010

-

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MKK Technologies

India . 956 parts In-Stock

1+ parts

$40.856

100+ parts

-

1k+ parts

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10k+ parts

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956

$40.856

-

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DigiPath Technology Company

USA . 956 parts In-Stock

1+ parts

$40.856

100+ parts

-

1k+ parts

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956

$40.856

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RC Electronics

USA . 42,294 parts In-Stock

1+ parts

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42,294

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Perfect Parts

USA . 31,595 parts In-Stock

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31,595

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Authorized Procurement Solutions

USA . 16,890 parts In-Stock

1+ parts

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16,890

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Lixinc

USA . 12,965 parts In-Stock

1+ parts

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100+ parts

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12,965

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Corphita

USA . 785 parts In-Stock

1+ parts

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785

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Parana Technologies

USA . 596 parts In-Stock

1+ parts

-

100+ parts

$25.978

1k+ parts

-

10k+ parts

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596

-

$25.978

-

-

Overview

Discover the STMPE1600QTR by STMicroelectronics, a cutting-edge Parallel I/O Ports device that brings unparalleled performance and reliability to your projects. With STMicroelectronics' renowned quality and expertise, this product offers seamless integration, robust functionality, and versatility for various applications. Experience the value of precision engineering and innovation with the STMPE1600QTR, providing customers with unmatched benefits and advantages in their designs. Elevate your projects with this exceptional solution from a trusted leader in the industry.

Feature Benefit Bullets

Surface Mount YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing overall manufacturing costs.

Maximum Supply Voltage 3.6 V

Supports a wide range of supply voltages, providing flexibility in system design and compatibility with different power sources.

Package Shape SQUARE

Square package shape facilitates easy placement and alignment on the PCB, optimizing space utilization.

No. of Bits 16

16-bit parallel I/O ports allow for high-speed data transfer and processing, ideal for applications requiring large amounts of data to be handled simultaneously.

Power Supplies (V) 1.8/3.3

Supports multiple power supply voltages, enabling compatibility with various system requirements and ensuring reliable operation.

No. of Terminals 24

Provides ample connectivity options for interfacing with external devices and peripherals, enhancing the versatility of the product.

Package Style (Meter) CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles offer flexibility in design and integration, catering to different application needs and spatial constraints.

Minimum Supply Voltage 1.65 V

Low minimum supply voltage allows for efficient power usage and operation, extending battery life in portable devices.

Maximum Operating Temperature 85 °C

High operating temperature range ensures reliable performance in harsh environments, making it suitable for industrial applications.

Minimum Operating Temperature -40 °C

Wide temperature range enables operation in extreme cold conditions, ensuring consistent functionality in various environments.

Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

No. of Ports 2

Dual ports offer increased connectivity options and flexibility in data communication, allowing for simultaneous data transfers and multiple interface connections.

Maximum Seated Height 1 mm

Low seated height profile facilitates compact and streamlined PCB layout, optimizing space utilization and enabling design flexibility.

Width 4 mm

Compact width dimension enables efficient integration into space-constrained designs, suitable for small form factor applications.

Maximum Time At Peak Reflow Temperature (s) 30

Supports quick and efficient reflow soldering processes, reducing assembly time and ensuring consistent solder joint quality.

Peak Reflow Temperature °C 260

High peak reflow temperature capability allows for reliable and robust soldering connections, ensuring long-lasting performance under thermal stress.

Length 4 mm

Compact length dimension facilitates space-efficient PCB layout designs, enabling integration into size-limited applications.

Temperature Grade INDUSTRIAL

Industrial temperature grade ensures reliable operation in demanding environments with wide temperature variations, making it suitable for rugged applications.

Peripheral IC Type PARALLEL IO PORT, GENERAL PURPOSE

General-purpose parallel I/O port IC provides versatile interfacing capabilities for a wide range of applications, offering flexibility and compatibility.

Technology CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, ensuring efficient and reliable performance.

Terminal Form NO LEAD

Lead-free terminal form complies with environmental regulations, ensuring eco-friendly and sustainable manufacturing practices.

Nominal Supply Voltage 1.8 V

Stable nominal supply voltage provides consistent power delivery for reliable operation and signal integrity, ensuring consistent performance.

Terminal Pitch 0.5 mm

Fine terminal pitch allows for high-density PCB designs, enabling compact and space-efficient placement of the IC for optimized board layout.

No. of I/O Lines 16

16 I/O lines offer sufficient interfacing capabilities for connecting to external devices and peripherals, facilitating seamless data exchange and communication.

Technical Specifications

Parallel I/O Ports STMPE1600QTR attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

STMPE1600QTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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