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STMPE2401TBR

STMicroelectronics

STMPE2401TBR by STMicroelectronics

STMPE2401TBR by STMicroelectronics is a CMOS parallel I/O port with 24 I/O lines, operating b/w 1.65V and 1.95V. It features a thin profile grid array package and supports industrial applications with a max temp of 85 °C. Ideal for compact electronic designs requiring efficient data handling.

Median Price

$1.375

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 8,061 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.375

8,061

-

-

-

$1.375

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 132 parts In-Stock

1+ parts

$2.793

100+ parts

-

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-

10k+ parts

-

132

$2.793

-

-

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Vyrian

USA . 4,731 parts In-Stock

1+ parts

$2.940

100+ parts

-

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-

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4,731

$2.940

-

-

-

Anansix

USA . 1,339 parts In-Stock

1+ parts

-

100+ parts

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1,339

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,407 parts In-Stock

1+ parts

$1.540

100+ parts

-

1k+ parts

-

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-

2,407

$1.540

-

-

-

Corphita

USA . 2,686 parts In-Stock

1+ parts

$2.646

100+ parts

-

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2,686

$2.646

-

-

-

Microchip USA

USA . 328 parts In-Stock

1+ parts

$9.510

100+ parts

-

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328

$9.510

-

-

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IDEA Electronic Components Group

UK . 187 parts In-Stock

1+ parts

$76.264

100+ parts

-

1k+ parts

$68.638

10k+ parts

-

187

$76.264

-

$68.638

-

MKK Technologies

India . 793 parts In-Stock

1+ parts

$143.410

100+ parts

-

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793

$143.410

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DigiPath Technology Company

USA . 793 parts In-Stock

1+ parts

$143.410

100+ parts

-

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793

$143.410

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Authorized Procurement Solutions

USA . 13,529 parts In-Stock

1+ parts

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13,529

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Perfect Parts

USA . 9,028 parts In-Stock

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9,028

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A-Z Elektronik GmbH

Germany . 6,848 parts In-Stock

1+ parts

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6,848

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GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

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3,000

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Parana Technologies

USA . 1,495 parts In-Stock

1+ parts

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100+ parts

$91.186

1k+ parts

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10k+ parts

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1,495

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$91.186

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Kepictronics

USA . 985 parts In-Stock

1+ parts

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985

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Overview

Unlock exceptional performance with the STMPE2401TBR from STMicroelectronics—a trusted leader in innovation and quality. This advanced parallel I/O port offers reliable functionality in a compact design, making it ideal for industrial applications where precision counts. Enjoy enhanced efficiency with low power consumption and robust temperature resilience, ensuring your projects meet the highest standards while maximizing value and reliability. Elevate your designs with STMicroelectronics—where excellence meets versatility!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides excellent protection against environmental factors, ensuring reliable performance.

Surface Mount: YES

Surface mount technology allows for a compact design and facilitates automated assembly, making production more efficient.

Maximum Supply Voltage: 1.95 V

This low maximum supply voltage makes the product suitable for power-sensitive applications.

Package Shape: RECTANGULAR

The rectangular package shape offers optimal layout flexibility on PCBs, allowing for efficient space utilization.

Power Supplies (V): 1.8

This standard voltage supply is compatible with a wide range of devices, enhancing versatility in design.

No. of Terminals: 36

The 36 terminals provide ample connectivity options for various applications, ensuring comprehensive functionality.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This design enables high-density mounting, which is ideal for space-constrained applications.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage contributes to energy efficiency, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for demanding industrial applications.

Minimum Operating Temperature: -40 °C

This wide temperature range ensures reliable operation in extreme environmental conditions.

Terminal Finish: TIN SILVER COPPER

The quality finish provides excellent solderability and corrosion resistance, enhancing long-term reliability.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient thermal management and better space utilization on the PCB.

Maximum Seated Height: 1.16 mm

A low seated height is advantageous for maintaining a slim profile in compact assemblies.

Width: 3.5 mm

A narrow width allows for flexible placement options on PCBs, facilitating design optimization.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard surface mount soldering processes, promoting manufacturing efficiency.

Peak Reflow Temperature °C: 260

This high peak temperature capability allows the component to endure the soldering process without damage.

Length: 3.6 mm

The small length supports compact circuit designs, which is increasingly important in modern electronics.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this product is built to withstand rigorous conditions, ensuring reliability in critical applications.

Peripheral IC Type: PARALLEL I/O PORT, GENERAL PURPOSE

As a general-purpose I/O port, it offers broad applicability across various devices and systems.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, making it ideal for a wide range of applications.

Terminal Form: BALL

Ball terminals improve solder joint reliability and enhance electrical performance in compact designs.

Nominal Supply Voltage: 1.8 V

The nominal voltage aligns with standard components, ensuring compatibility and ease of integration into existing designs.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density connectivity while maintaining a manageable footprint.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, aiding in proper handling and storage practices.

No. of I/O Lines: 24

With 24 I/O lines, this product provides sufficient connectivity options for integrating multiple signals.

Technical Specifications

Parallel I/O Ports STMPE2401TBR attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

JESD-30 Code:

R-PBGA-B36

JESD-609 Code:

e1

Length:

3.6 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Ports:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA36,6X6,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.16 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Peripheral IC Type:

Trade Compliance

STMPE2401TBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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