Loading...

STMPE1601TBR

STMicroelectronics

STMPE1601TBR by STMicroelectronics

STMPE1601TBR by STMicroelectronics is a 16-bit parallel I/O port IC designed for industrial applications. It operates b/w 1.65V and 3.6V, with a max temp of 85 °C, featuring a compact grid array package. Ideal for general-purpose interfacing in space-constrained environments.

Median Price

$0.760

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.760

3,500

-

-

-

$0.760

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 32,356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

32,356

-

-

-

-

Vyrian

USA . 5,659 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,659

-

-

-

-

Digiode

USA . 2,967 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,967

-

-

-

-

Cyclops Electronics Ltd

UK . 2,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,700

-

-

-

-

Anansix

USA . 1,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,920

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 931 parts In-Stock

1+ parts

$17.798

100+ parts

-

1k+ parts

$16.018

10k+ parts

-

931

$17.798

-

$16.018

-

AZTECH Wire

Italy . 510 parts In-Stock

1+ parts

$21.570

100+ parts

-

1k+ parts

-

10k+ parts

-

510

$21.570

-

-

-

MKK Technologies

India . 703 parts In-Stock

1+ parts

$33.469

100+ parts

-

1k+ parts

-

10k+ parts

-

703

$33.469

-

-

-

DigiPath Technology Company

USA . 703 parts In-Stock

1+ parts

$33.469

100+ parts

-

1k+ parts

-

10k+ parts

-

703

$33.469

-

-

-

Corohmni

South Africa . 3,216 parts In-Stock

1+ parts

$50.441

100+ parts

-

1k+ parts

-

10k+ parts

-

3,216

$50.441

-

-

-

Kepictronics

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,000

-

-

-

-

Authorized Procurement Solutions

USA . 15,548 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,548

-

-

-

-

Perfect Parts

USA . 6,545 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,545

-

-

-

-

GreenTree Electronics

Israel . 6,170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,170

-

-

-

-

Microchip USA

USA . 6,116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,116

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,912 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,912

-

-

-

-

Corphita

USA . 2,442 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,442

-

-

-

-

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Parana Technologies

USA . 119 parts In-Stock

1+ parts

-

100+ parts

$21.281

1k+ parts

-

10k+ parts

-

119

-

$21.281

-

-

Cyclops Electronics Ltd (Excess)

UK . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30

-

-

-

-

Overview

Unlock unparalleled performance with the STMPE1601TBR from STMicroelectronics, a leader in innovation and reliability. This 16-bit parallel I/O port offers robust industrial-grade resilience and low power consumption, making it ideal for diverse applications—from automation to consumer electronics. Experience seamless integration into your projects, ensuring longevity and efficiency that elevate your designs. Choose quality; choose STMicroelectronics for lasting value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling easier integration into smaller devices without compromising performance.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V provides flexibility for various circuit designs, accommodating both low and moderate voltage applications.

Package Shape: SQUARE

The square package shape optimizes space on printed circuit boards, allowing for efficient layout and design.

No. of Bits: 16

With 16 bits, this component offers a wide data handling capacity, making it ideal for applications requiring rich data transfer.

Power Supplies (V): 1.8/3.3

The dual power supply option (1.8/3.3 V) offers versatility, allowing the product to be used in a variety of systems with differing voltage requirements.

No. of Terminals: 25

Having 25 terminals allows for a greater number of connections, promoting enhanced functionality and connectivity with other components.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

A grid array package with a thin profile and fine pitch allows for high-density mounting, which is beneficial for compact electronic designs.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage of 1.65 V makes this device energy-efficient, contributing to lower power consumption in applications.

Maximum Operating Temperature: 85 °C

The ability to operate at a maximum temperature of 85 °C ensures reliability in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is designed to function in extreme conditions, making it ideal for harsh environments.

Terminal Finish: MATTE TIN

A matte tin terminal finish enhances solderability and prevents oxidation, ensuring long-lasting connections and performance.

Terminal Position: BOTTOM

Bottom terminal position allows for effective surface mounting, promoting a compact footprint on circuit boards.

Maximum Seated Height: 1.16 mm

A low maximum seated height of 1.16 mm enables the component to fit into spaces where height restrictions are critical.

Width: 3 mm

The compact width of 3 mm is advantageous for space-constrained applications where every millimeter counts.

Length: 3 mm

Similar to the width, a 3 mm length supports compact designs, making this product versatile for various applications.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, this product guarantees reliability and performance in demanding conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Being a general-purpose parallel I/O port makes this product highly versatile for multiple applications, from basic input/output tasks to complex data manipulation.

Technology: CMOS

Using CMOS technology allows for lower power consumption and higher performance, making this component efficient in its operations.

Terminal Form: BALL

The ball terminal form ensures a reliable connection during soldering processes, enhancing overall product reliability.

Nominal Supply Voltage: 1.8 V

Operating on a nominal supply voltage of 1.8 V makes it suitable for low-power applications, contributing to longer battery life in portable devices.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density connections while maintaining usability during assembly and soldering.

No. of I/O Lines: 16

With 16 I/O lines, this product provides extensive capabilities for data transfer, making it ideal for a range of applications requiring parallel data communication.

Technical Specifications

Parallel I/O Ports STMPE1601TBR attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.16 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

3 mm

Peripheral IC Type:

Trade Compliance

STMPE1601TBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 7