Loading...

STMPE2403TBR

STMicroelectronics

STMPE2403TBR by STMicroelectronics

STMPE2403TBR by STMicroelectronics is a 24-bit parallel I/O port IC designed for industrial applications. It operates within a supply voltage range of 1.65V to 1.95V and withstands temperatures from -40 °C to 85°C. Its compact grid array package ensures efficient space utilization in electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,640

-

-

-

-

Anansix

USA . 874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

874

-

-

-

-

Digiode

USA . 496 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

496

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 408 parts In-Stock

1+ parts

$8.100

100+ parts

-

1k+ parts

-

10k+ parts

-

408

$8.100

-

-

-

Corohmni

South Africa . 2,969 parts In-Stock

1+ parts

$37.221

100+ parts

-

1k+ parts

-

10k+ parts

-

2,969

$37.221

-

-

-

IDEA Electronic Components Group

UK . 1,003 parts In-Stock

1+ parts

$39.644

100+ parts

-

1k+ parts

$35.679

10k+ parts

-

1,003

$39.644

-

$35.679

-

Microchip USA

USA . 179 parts In-Stock

1+ parts

$44.665

100+ parts

-

1k+ parts

-

10k+ parts

-

179

$44.665

-

-

-

MKK Technologies

India . 1,385 parts In-Stock

1+ parts

$74.547

100+ parts

-

1k+ parts

-

10k+ parts

-

1,385

$74.547

-

-

-

DigiPath Technology Company

USA . 1,385 parts In-Stock

1+ parts

$74.547

100+ parts

-

1k+ parts

-

10k+ parts

-

1,385

$74.547

-

-

-

Corphita

USA . 1,714 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,714

-

-

-

-

Parana Technologies

USA . 53 parts In-Stock

1+ parts

-

100+ parts

$47.400

1k+ parts

-

10k+ parts

-

53

-

$47.400

-

-

Overview

Elevate your designs with the STMPE2403TBR from STMicroelectronics, a leader in innovation and quality. This robust parallel I/O port offers superior performance across diverse industrial applications, ensuring reliability even in demanding conditions. With its compact design and low power consumption, it seamlessly integrates into your projects, enhancing efficiency while saving space. Trust in ST's legacy of excellence to deliver unmatched value for your next breakthrough.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient utilization of space on printed circuit boards.

Maximum Supply Voltage: 1.95 V

The low maximum supply voltage ensures compatibility with modern low-power devices, reducing overall energy consumption.

Package Shape: SQUARE

The square shape enables easy arrangement and alignment in circuit layouts, promoting design flexibility.

No. of Bits: 24

With 24 bits, this product provides ample data throughput options for various applications, from simple control to complex data processing.

Power Supplies (V): 1.8

Operating at a nominal power supply of 1.8 V highlights the product's efficiency, making it suitable for low-power applications.

No. of Terminals: 36

The high number of terminals allows for a greater number of connections, enhancing system flexibility and performance.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The thin profile and fine pitch design reduce board space requirements, making it ideal for high-density applications.

Minimum Supply Voltage: 1.65 V

The ability to operate at lower voltages maximizes energy efficiency and expands its usability in a range of devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C makes this product suitable for industrial applications where temperature variations may occur.

Minimum Operating Temperature: -40 °C

A wide temperature range ensures reliability in extreme environments, making the product ideal for challenging applications.

Terminal Position: BOTTOM

Bottom terminal positioning allows for better access for soldering and improves the assembly process on circuit boards.

Maximum Seated Height: 1.16 mm

The compact seated height aids in low-profile designs, making it ideal for portable and space-constrained devices.

Width: 3.5 mm

The narrow width facilitates placement in tight spaces, contributing to optimized circuit board layout.

Length: 3.6 mm

Short length allows for compact assembly, enhancing the integration of multiple components on a single board.

Temperature Grade: INDUSTRIAL

Industrial-grade specifications enhance reliability and performance in harsh industrial environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, it serves a variety of functions, adding to the versatility of the product.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it ideal for portable electronic devices.

Terminal Form: BALL

Ball terminals simplify assembly through reflow soldering processes, improving manufacturing efficiency.

Nominal Supply Voltage: 1.8 V

The low nominal voltage enhances energy savings and ensures compatibility with battery-operated devices.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm enables high-density interconnections, which is critical for modern compact electronic designs.

No. of I/O Lines: 24

Having 24 I/O lines maximizes data exchange capability, allowing for the simultaneous processing of multiple signals.

Technical Specifications

Parallel I/O Ports STMPE2403TBR attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B36

Length:

3.6 mm

No. of Bits:

24

No. of I/O Lines:

24

No. of Ports:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA36,6X6,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.16 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.5 mm

Peripheral IC Type:

Trade Compliance

STMPE2403TBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 7