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TCA6416PWRG4

Texas Instruments

TCA6416PWRG4 by Texas Instruments

TCA6416PWRG4 by Texas Instruments is a 16-bit parallel I/O port with supply voltage ranging from 1.65V to 5.5V. It features a small outline package, dual terminal position, and industrial temperature grade suitable for general purpose applications requiring CMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,372 parts In-Stock

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5,372

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Digiode

USA . 166 parts In-Stock

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166

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Distributors (Availability)

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AZTECH Wire

Italy . 807 parts In-Stock

1+ parts

$9.727

100+ parts

-

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807

$9.727

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One Stop Electronics

USA . 1,638 parts In-Stock

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$19.000

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1,638

$19.000

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Parana Technologies

USA . 2,076 parts In-Stock

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$54.496

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2,076

$54.496

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DigiPath Technology Company

USA . 1,086 parts In-Stock

1+ parts

$60.007

100+ parts

$55.207

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1,086

$60.007

$55.207

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ChromeModa Solutions

Germany . 3,545 parts In-Stock

1+ parts

$61.232

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$50.210

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3,545

$61.232

$50.210

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IDEA Electronic Components Group

UK . 2,291 parts In-Stock

1+ parts

$61.232

100+ parts

$58.170

1k+ parts

$55.109

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2,291

$61.232

$58.170

$55.109

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Corohmni

South Africa . 1,893 parts In-Stock

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$77.799

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$77.799

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Corphita

USA . 2,432 parts In-Stock

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Overview

Unlock endless possibilities with the TCA6416PWRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Parallel I/O Ports for a wide range of applications. With 16 bits and dual ports, this product offers unparalleled value and benefits. From industrial automation to consumer electronics, this versatile device provides reliability and efficiency, making it a must-have for your projects. Experience the superior performance and innovation that Texas Instruments is known for with the TCA6416PWRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

The surface mount capability allows for easy integration onto printed circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it versatile for various applications.

No. of Bits: 16

Provides a high number of bits for parallel I/O operations, allowing for efficient data transfer.

Minimum Operating Temperature: -40 °C

Operating in extreme low temperatures makes this product suitable for use in harsh environments.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration, ensuring reliability during assembly processes.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Designed for general purpose parallel I/O operations, making it suitable for a wide range of applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Parallel I/O Ports TCA6416PWRG4 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

TCA6416PWRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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