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TMS9901JL

Texas Instruments

TMS9901JL by Texas Instruments

TMS9901JL by Texas Instruments is a MOS technology chip with 40 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, suitable for commercial applications. This Parallel I/O Ports device in RECTANGULAR CERAMIC shape with DUAL terminal position has a pitch of 2.54 mm, ideal for various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,525 parts In-Stock

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Digiode

USA . 3,926 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Microfarads

USA . 1 parts In-Stock

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Electronic Expediters

USA . 1 parts In-Stock

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One Stop Electronics

USA . 1,295 parts In-Stock

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$3.000

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$3.000

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AZTECH Wire

Italy . 348 parts In-Stock

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$7.115

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Corohmni

South Africa . 350 parts In-Stock

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$28.808

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$28.808

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Ampacity Inc.

Singapore . 1,023 parts In-Stock

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$29.000

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Parana Technologies

USA . 166 parts In-Stock

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$30.535

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$69.154

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ChromeModa Solutions

Germany . 3,825 parts In-Stock

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$34.309

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$28.133

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IDEA Electronic Components Group

UK . 1,812 parts In-Stock

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$34.309

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$32.594

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$30.878

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Continental Prestige Electronics

USA . 5,711 parts In-Stock

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Argo Parts USA

USA . 1,286 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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DigiPath Technology Company

USA . 690 parts In-Stock

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$30.933

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Corphita

USA . 198 parts In-Stock

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Overview

Unlock endless possibilities with the TMS9901JL by Texas Instruments, a high-quality Parallel I/O Ports component that delivers unmatched performance and reliability. Designed with precision and expertise, this product is perfect for a wide range of applications. From industrial automation to consumer electronics, this versatile device offers seamless integration and superior functionality. Experience the value and benefits that only Texas Instruments can provide, and revolutionize your projects with the TMS9901JL. Elevate your designs and exceed expectations with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high durability and thermal resistance, making this product suitable for harsh operating conditions.

Package Shape: RECTANGULAR

Rectangular shape allows for easier integration and placement within a circuit board or system.

No. of Terminals: 40

With 40 terminals, this product offers ample connectivity options for various devices and components.

Package Style (Meter): IN-LINE

In-line package style facilitates easy and organized wiring, minimizing the risk of errors during installation.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can reliably function in a wide range of environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that the product remains operational even in colder conditions.

Terminal Position: DUAL

Dual terminal positions allow for flexibility in connecting the product to other devices or systems.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures that the product is suitable for standard commercial applications.

Technology: MOS

MOS technology offers high-speed operation and low power consumption, making the product efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure connections and easy soldering during assembly.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch offers compatibility with standard connectors and sockets, enhancing the product's versatility.

Technical Specifications

Parallel I/O Ports TMS9901JL attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Parallel IO Port

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS9901JL Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-112-6361, 5962011126361

NIIN

011126361

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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