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TMS9901NL

Texas Instruments

TMS9901NL by Texas Instruments

TMS9901NL by Texas Instruments is a MOS technology chip with 40 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, suitable for commercial applications. This Parallel I/O Ports device is ideal for various electronic systems requiring precise control and interfacing capabilities.

Median Price

$12.250

Lifecycle Status

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25

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1k+

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Forefront Electronics and Design

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LIBRA Elektronik GmbH

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Manoshevitz Elec. Sales

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First Choice Components Inc.

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Inland Empire Components Inc.

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J & M Industries LLC

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AZTECH Wire

Italy . 402 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 536 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

USA . 1,882 parts In-Stock

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ChromeModa Solutions

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Bastille Electronics

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock endless possibilities with the TMS9901NL by Texas Instruments, a top-tier parallel I/O port that guarantees unrivaled quality and reliability. Designed with cutting-edge technology and housed in a durable plastic/epoxy package, this innovative product boasts 40 terminals and a commercial temperature grade for maximum performance. Ideal for a wide range of applications, the TMS9901NL offers unparalleled value and benefits to customers seeking seamless integration and exceptional functionality. Experience the power of Texas Instruments and elevate your projects to new heights with the TMS9901NL.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and mounting in electronic devices or systems.

No. of Terminals: 40

The high number of terminals provides ample connectivity options for various devices or components.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to connect multiple devices in a straight line, saving space and simplifying wiring.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for use in a wide range of environments without affecting performance.

Terminal Position: DUAL

The dual terminal position provides redundancy and increased reliability in connectivity.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures consistent performance in standard operating conditions.

Technology: MOS

The MOS technology offers high-speed data transfer and low power consumption, making the product efficient and reliable.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for secure and stable connections, ideal for applications where vibration or movement is a concern.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch provides compatibility with standard spacing requirements, making it easy to integrate into existing systems or designs.

Technical Specifications

Parallel I/O Ports TMS9901NL attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Parallel IO Port

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS9901NL Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-173-5531, 5962011735531

NIIN

011735531

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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