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TMS9901JDL

Texas Instruments

TMS9901JDL by Texas Instruments

TMS9901JDL by Texas Instruments is a MOS technology chip with 40 terminals in an IN-LINE package. It operates b/w 0-70°C, suitable for commercial applications. This Parallel I/O Ports device in CERAMIC package is ideal for various electronic systems requiring dual terminal position control.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,576 parts In-Stock

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Digiode

USA . 1,417 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Fibra_Brandt Electronic GMBH

Germany . 10 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 2 parts In-Stock

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MRC Electronics

USA . 1 parts In-Stock

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Ampacity Inc.

Singapore . 322 parts In-Stock

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$5.000

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322

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AZTECH Wire

Italy . 401 parts In-Stock

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$12.796

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One Stop Electronics

USA . 1,642 parts In-Stock

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$20.000

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Corohmni

South Africa . 2,375 parts In-Stock

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$42.750

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Parana Technologies

USA . 828 parts In-Stock

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$68.296

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DigiPath Technology Company

USA . 674 parts In-Stock

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$75.202

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$69.186

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674

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ChromeModa Solutions

Germany . 5,456 parts In-Stock

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$76.737

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$62.924

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IDEA Electronic Components Group

UK . 1,199 parts In-Stock

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$76.737

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$72.900

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$69.063

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A-Z Elektronik GmbH

Germany . 5,186 parts In-Stock

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Continental Prestige Electronics

USA . 3,459 parts In-Stock

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Corphita

USA . 3,210 parts In-Stock

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Argo Parts USA

USA . 2,158 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Perfect Parts

USA . 4 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2 parts In-Stock

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Overview

Enhance your electronic projects with the TMS9901JDL Parallel I/O Ports by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments offers a wide range of innovative solutions for your applications. The TMS9901JDL provides seamless integration and high performance, making it the perfect choice for your next project. Experience the value and benefits of this product that will surely exceed your expectations. Trust Texas Instruments for all your electronic needs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its durability and thermal stability, making it a reliable choice for electronic components that require long-term use and high operating temperatures.

No. of Terminals: 40

Having a higher number of terminals allows for more connections, increasing the flexibility and versatility of this parallel I/O port for various applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this parallel I/O port can withstand high heat conditions without compromising performance or durability.

Technology: MOS

Metal-Oxide-Semiconductor (MOS) technology is known for its low power consumption and high speed, making this parallel I/O port energy-efficient and capable of fast data transfers.

Technical Specifications

Parallel I/O Ports TMS9901JDL attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Parallel IO Port

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS9901JDL Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-173-5531, 5962011735531, 5962-01-112-6361, 5962011126361

NIIN

011735531, 011126361

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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