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TCA6416PWG4

Texas Instruments

TCA6416PWG4 by Texas Instruments

TCA6416PWG4 by Texas Instruments is a 16-bit parallel I/O port with 2 ports, operating at a max frequency of 0.4 MHz. It has a supply voltage range of 1.65V to 5.5V and can withstand industrial temperatures from -40°C to 85°C. This IC is commonly used in applications requiring general-purpose parallel I/O interfacing in compact designs due to its small outline package style and low power consumption of only 0.03mA at nominal voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,254 parts In-Stock

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Digiode

USA . 920 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 60 parts In-Stock

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Prism Electronics

USA . 32 parts In-Stock

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AZTECH Wire

Italy . 368 parts In-Stock

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$4.912

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$4.912

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One Stop Electronics

USA . 1,213 parts In-Stock

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$12.000

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Parana Technologies

USA . 1,660 parts In-Stock

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$33.165

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$3,079.870

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$29.848

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1,660

$33.165

$3,079.870

$29.848

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DigiPath Technology Company

USA . 1,860 parts In-Stock

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$36.519

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$36.519

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ChromeModa Solutions

Germany . 4,658 parts In-Stock

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$37.264

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$30.556

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IDEA Electronic Components Group

UK . 1,411 parts In-Stock

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$37.264

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$35.401

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$33.538

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1,411

$37.264

$35.401

$33.538

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Advanced Electronics

New Zealand . 850 parts In-Stock

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$45.165

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$44.713

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$42.907

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850

$45.165

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$42.907

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Corohmni

South Africa . 242 parts In-Stock

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$65.267

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Microchip USA

USA . 1,476 parts In-Stock

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Corphita

USA . 1,256 parts In-Stock

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Perfect Parts

USA . 36 parts In-Stock

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Overview

Enhance the capabilities of your electronic devices with the TCA6416PWG4 by Texas Instruments, a top-tier manufacturer known for its superior quality products. As a Parallel I/O Port, this component offers unparalleled flexibility and functionality for a wide range of applications. With a maximum supply voltage of 5.5V and a small outline package style, this device provides reliable performance in industrial settings. Unlock the potential of your designs with the TCA6416PWG4 and experience the benefits of enhanced connectivity and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable devices.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power supply inputs, making it versatile for various applications.

No. of Bits: 16

Having 16 bits allows for a higher data transfer rate and compatibility with systems requiring a larger data capacity.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can function reliably even in harsh environmental conditions.

No. of Ports: 2

Having 2 ports increases the product's connectivity and flexibility in use with multiple devices simultaneously.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high-speed operation, making it energy-efficient and fast.

Technical Specifications

Parallel I/O Ports TCA6416PWG4 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

Maximum Clock Frequency:

.4 MHz

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Parallel IO Port

Maximum Supply Current:

.03 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

TCA6416PWG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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