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PCA9554APWG4

Texas Instruments

PCA9554APWG4 by Texas Instruments

PCA9554APWG4 by Texas Instruments is an 8-bit parallel I/O port with a max supply voltage of 5.5V and operating temperature range from -40 to 85°C. It features a small outline package style, suitable for industrial applications requiring general-purpose parallel I/O functionality at a clock frequency of up to 0.4MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,818 parts In-Stock

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5,818

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Digiode

USA . 3,956 parts In-Stock

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3,956

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EMSNET

USA . 265 parts In-Stock

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265

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 631 parts In-Stock

1+ parts

$13.967

100+ parts

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631

$13.967

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Ampacity Inc.

Singapore . 1,564 parts In-Stock

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$16.000

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$16.000

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One Stop Electronics

USA . 682 parts In-Stock

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$16.000

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682

$16.000

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Semicontronic

India . 347 parts In-Stock

1+ parts

$26.000

100+ parts

$25.350

1k+ parts

$25.220

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347

$26.000

$25.350

$25.220

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Parana Technologies

USA . 1,341 parts In-Stock

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$35.974

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1,341

$35.974

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ChromeModa Solutions

Germany . 919 parts In-Stock

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$40.420

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$33.144

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919

$40.420

$33.144

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IDEA Electronic Components Group

UK . 432 parts In-Stock

1+ parts

$40.420

100+ parts

$38.399

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$36.378

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432

$40.420

$38.399

$36.378

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Corohmni

South Africa . 388 parts In-Stock

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$67.859

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388

$67.859

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Continental Prestige Electronics

USA . 4,424 parts In-Stock

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Argo Parts USA

USA . 2,549 parts In-Stock

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Corphita

USA . 2,042 parts In-Stock

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Microchip USA

USA . 1,244 parts In-Stock

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DigiPath Technology Company

USA . 64 parts In-Stock

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$36.443

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64

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$36.443

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Elevate your electronic designs with the PCA9554APWG4 by Texas Instruments, a top-tier manufacturer known for delivering high-quality components. This parallel I/O port offers unmatched versatility and performance for a wide range of applications. Whether you're working on industrial automation, consumer electronics, or IoT devices, this compact and reliable solution is sure to streamline your project and enhance functionality. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations, bringing value and efficiency to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers durability and light weight, making the product easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation onto circuit boards, saving time and effort.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage provides flexibility and compatibility with a wide range of systems and applications.

Package Shape: RECTANGULAR

Rectangular shape ensures a compact and space-saving design, ideal for devices with limited space.

No. of Bits: 8

8 bits provide sufficient data transfer capability for various parallel I/O operations.

Power Supplies (V): 2.5/5

Dual power supply options allow for versatile and adaptable usage in different voltage environments.

No. of Terminals: 16

16 terminals offer ample connectivity options for interfacing with external devices and circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the PCB and enables a streamlined and sleek overall design.

Minimum Supply Voltage: 2.3 V

Low minimum supply voltage ensures efficient power consumption and compatibility with lower voltage systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable operation even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting and connectivity options for different PCB layouts.

Maximum Seated Height: 1.2 mm

Low maximum seated height allows for a compact and low-profile design, suitable for slim devices.

Width: 4.4 mm

Narrow width facilitates space-saving integration on the PCB and enables compact device designs.

Maximum Clock Frequency: 0.4 MHz

High maximum clock frequency ensures fast and efficient data transfer for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures proper soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering and assembly of the product on the PCB.

Length: 5 mm

Compact length allows for easy and efficient installation on the PCB without taking up excessive space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in harsh industrial environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General-purpose parallel I/O port provides versatile connectivity options for various external devices and peripherals.

Technology: CMOS

CMOS technology offers low power consumption and high speed, ideal for efficient parallel I/O operations.

Terminal Form: GULL WING

Gull-wing terminal form provides easy surface mounting and secure mechanical connection to the PCB.

Maximum Supply Current: 0.175 mA

Low maximum supply current ensures efficient power usage and minimizes heat dissipation for reliable operation.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5V ensures compatibility with a wide range of systems and applications.

Terminal Pitch: 0.65 mm

Small terminal pitch allows for dense packing and high-density integration on the PCB, saving space and improving efficiency.

No. of I/O Lines: 8

8 I/O lines provide sufficient interfacing options for connecting with external devices and peripherals in parallel.

Technical Specifications

Parallel I/O Ports PCA9554APWG4 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

Maximum Clock Frequency:

.4 MHz

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Parallel IO Ports

Maximum Supply Current:

.175 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

PCA9554APWG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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