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PCF8574T/3,112

NXP Semiconductors

PCF8574T/3,112 by NXP Semiconductors

PCF8574T/3,112 by NXP Semiconductors is a CMOS technology-based Parallel I/O Port IC with 8 I/O lines. It operates b/w -40 to 85°C and supports supply voltage range of 2.5V to 6V. Widely used in industrial applications for general purpose parallel input/output operations due to its small outline package style.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Digiode

USA . 3,827 parts In-Stock

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Anansix

USA . 2,395 parts In-Stock

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Vyrian

USA . 854 parts In-Stock

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Nova Conductors

Japan . 64 parts In-Stock

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One Stop Electronics

USA . 1,643 parts In-Stock

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$7.000

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AZTECH Wire

Italy . 768 parts In-Stock

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Ampacity Inc.

Singapore . 1,123 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,094 parts In-Stock

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Corohmni

South Africa . 2,138 parts In-Stock

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UNI Independent Distributors

Spain . 3,263 parts In-Stock

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Argo Parts USA

USA . 2,689 parts In-Stock

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Aranea Global

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Continental Prestige Electronics

USA . 1,020 parts In-Stock

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Corphita

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Overview

Discover the seamless integration and top-notch performance of the PCF8574T/3,112 by NXP Semiconductors. Crafted with precision and expertise, this Parallel I/O Port device offers unparalleled value and benefits to customers across various applications. With its reliable technology and industrial-grade quality, this product provides optimal functionality and ease of use. Experience efficiency like never before with the PCF8574T/3,112 - the ultimate solution for your parallel IO needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight yet durable housing for the product, making it suitable for various applications.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 6 V

Can handle a range of supply voltages, providing flexibility in different system configurations.

Minimum Supply Voltage: 2.5 V

Allows for operation in low power situations, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, making it versatile in various climates.

No. of I/O Lines: 8

Provides multiple input/output options, allowing for versatile connectivity in different systems.

Technical Specifications

Parallel I/O Ports PCF8574T/3,112 attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

PCF8574T/3,112 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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