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TCA6418EYFPR

Texas Instruments

TCA6418EYFPR by Texas Instruments

TCA6418EYFPR by Texas Instruments is an 18-bit parallel I/O port with a max supply voltage of 5.5V and operating temperature range from -40 to 85°C. It features a grid array package style, suitable for industrial applications requiring general-purpose peripheral ICs with a clock frequency up to 1MHz.

Median Price

$2.410

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 141,218 parts In-Stock

1+ parts

$1.220

100+ parts

$1.069

1k+ parts

$0.604

10k+ parts

-

141,218

$1.220

$1.069

$0.604

-

DigiKey

USA . 666 parts In-Stock

1+ parts

$2.410

100+ parts

$1.463

1k+ parts

$1.343

10k+ parts

-

666

$2.410

$1.463

$1.343

-

Mouser Electronics

USA . 2,348 parts In-Stock

1+ parts

$2.450

100+ parts

$1.470

1k+ parts

$1.350

10k+ parts

$1.140

2,348

$2.450

$1.470

$1.350

$1.140

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$0.928

100+ parts

-

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-

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870

$0.928

-

-

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Digiode

USA . 189 parts In-Stock

1+ parts

$1.159

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-

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189

$1.159

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Vyrian

USA . 50,353 parts In-Stock

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-

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50,353

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-

-

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Chip Stock

USA . 17,300 parts In-Stock

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-

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17,300

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Classic Components Corporation

USA . 1,793 parts In-Stock

1+ parts

-

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1,793

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SPM Sales

USA . 110 parts In-Stock

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110

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Cyclops Electronics Ltd

UK . 50 parts In-Stock

1+ parts

-

100+ parts

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,384 parts In-Stock

1+ parts

$0.928

100+ parts

-

1k+ parts

-

10k+ parts

$0.910

3,384

$0.928

-

-

$0.910

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.928

100+ parts

$0.910

1k+ parts

-

10k+ parts

-

2,000

$0.928

$0.910

-

-

Argo Parts USA

USA . 419 parts In-Stock

1+ parts

$0.928

100+ parts

-

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10k+ parts

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419

$0.928

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-

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Ampacity Inc.

Singapore . 50,288 parts In-Stock

1+ parts

$1.040

100+ parts

-

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10k+ parts

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50,288

$1.040

-

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Semicontronic

India . 49,873 parts In-Stock

1+ parts

$1.040

100+ parts

$1.014

1k+ parts

$1.009

10k+ parts

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49,873

$1.040

$1.014

$1.009

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Corphita

USA . 3,991 parts In-Stock

1+ parts

$1.098

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3,991

$1.098

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Microchip USA

USA . 2,904 parts In-Stock

1+ parts

$5.459

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2,904

$5.459

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-

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Parana Technologies

USA . 724 parts In-Stock

1+ parts

$26.245

100+ parts

-

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$26.838

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724

$26.245

-

$26.838

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DigiPath Technology Company

USA . 395 parts In-Stock

1+ parts

$28.899

100+ parts

-

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395

$28.899

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-

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IDEA Electronic Components Group

UK . 1,940 parts In-Stock

1+ parts

$29.489

100+ parts

$28.015

1k+ parts

$26.540

10k+ parts

-

1,940

$29.489

$28.015

$26.540

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ChromeModa Solutions

Germany . 108 parts In-Stock

1+ parts

$29.489

100+ parts

$24.181

1k+ parts

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108

$29.489

$24.181

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Corohmni

South Africa . 2,031 parts In-Stock

1+ parts

$81.424

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2,031

$81.424

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Perfect Parts

USA . 20,080 parts In-Stock

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20,080

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,500 parts In-Stock

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4,500

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Lixinc

USA . 3,356 parts In-Stock

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3,356

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Overview

Enhance your electronic projects with the TCA6418EYFPR from Texas Instruments. Crafted with precision and expertise, this Parallel I/O Port offers unparalleled quality and reliability. With a wide range of applications in various industries, this product provides value, efficiency, and versatility to your designs. Experience seamless operation and enhanced performance with Texas Instruments’ innovative technology. Elevate your projects to the next level with the TCA6418EYFPR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of this product on a PCB, saving time and effort.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage of 5.5V, this product can handle a wide range of power inputs, increasing its versatility.

Package Shape: SQUARE

The square package shape simplifies the integration of this product into circuit designs, optimizing space utilization.

No. of Bits: 18

The 18 bits offer a wide range of input/output options, enhancing the product's functionality and compatibility with various systems.

Power Supplies (V): 1.8/3.3

Supporting multiple power supply voltages of 1.8V and 3.3V makes this product adaptable to different power configurations.

No. of Terminals: 25

The 25 terminals provide ample connection points, allowing for flexible connectivity and easy integration into circuits.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style offers high-density packaging, saving valuable PCB space.

Minimum Supply Voltage: 1.65 V

With a low minimum supply voltage of 1.65V, this product can operate efficiently even in low-power scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this product to function effectively in harsh cold environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin/silver/copper provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and ensures secure connections, enhancing the product's overall reliability.

Maximum Seated Height: 0.5 mm

The low maximum seated height of 0.5mm allows for compact designs and efficient use of vertical space on the PCB.

Width: 1.96 mm

The narrow width of 1.96mm enables this product to be used in space-constrained applications without sacrificing functionality.

Maximum Clock Frequency: 1 MHz

With a maximum clock frequency of 1MHz, this product can support high-speed data transfer and processing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering during manufacturing processes, reducing the risk of solder joint failure.

Length: 1.96 mm

The compact length of 1.96mm allows this product to be easily integrated into tight spaces on the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that this product can operate reliably in demanding industrial environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

The peripheral IC type of parallel IO port, general purpose, makes this product versatile and suitable for a wide range of applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, enhancing overall performance and reliability.

Terminal Form: BALL

The ball terminal form provides secure connections and simplifies installation, ensuring stable operation in various conditions.

Nominal Supply Voltage: 2.3 V

The nominal supply voltage of 2.3V offers a balanced power input that is suitable for many common applications.

Terminal Pitch: 0.4 mm

The fine terminal pitch of 0.4mm enables high-density packaging and efficient use of PCB space.

No. of I/O Lines: 18

With 18 I/O lines, this product offers flexible input/output options, making it a versatile choice for various system configurations.

Technical Specifications

Parallel I/O Ports TCA6418EYFPR attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

Address Bus Width:

1

Maximum Clock Frequency:

1 MHz

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Length:

1.96 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

18

No. of I/O Lines:

18

No. of Ports:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

2.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.96 mm

Peripheral IC Type:

Trade Compliance

TCA6418EYFPR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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