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PCA9554ADGVRG4

Texas Instruments

PCA9554ADGVRG4 by Texas Instruments

PCA9554ADGVRG4 by Texas Instruments is an 8-bit parallel I/O port with a supply voltage range of 2.3V to 5.5V and max clock frequency of 0.4MHz. It is ideal for industrial applications requiring general-purpose peripheral ICs with dual-terminal position and Gull Wing form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,401 parts In-Stock

1+ parts

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5,401

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Digiode

USA . 3,507 parts In-Stock

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3,507

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 732 parts In-Stock

1+ parts

$19.290

100+ parts

-

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732

$19.290

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One Stop Electronics

USA . 794 parts In-Stock

1+ parts

$23.000

100+ parts

-

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794

$23.000

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Parana Technologies

USA . 1,374 parts In-Stock

1+ parts

$35.176

100+ parts

$3,266.659

1k+ parts

$31.659

10k+ parts

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1,374

$35.176

$3,266.659

$31.659

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DigiPath Technology Company

USA . 780 parts In-Stock

1+ parts

$38.734

100+ parts

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780

$38.734

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ChromeModa Solutions

Germany . 5,607 parts In-Stock

1+ parts

$39.524

100+ parts

$32.410

1k+ parts

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5,607

$39.524

$32.410

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IDEA Electronic Components Group

UK . 1,948 parts In-Stock

1+ parts

$39.524

100+ parts

$37.548

1k+ parts

$35.572

10k+ parts

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1,948

$39.524

$37.548

$35.572

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Corohmni

South Africa . 797 parts In-Stock

1+ parts

$78.375

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797

$78.375

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Corphita

USA . 1,205 parts In-Stock

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1,205

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Overview

Enhance your electronic designs with the PCA9554ADGVRG4 by Texas Instruments, a high-quality Parallel I/O Port perfect for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, this product offers unparalleled value and benefits to customers. Whether you're working on industrial automation, consumer electronics, or IoT devices, this versatile component provides reliability, efficiency, and ease of use. Upgrade your projects today with the PCA9554ADGVRG4 and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and install.

Surface Mount: YES

Surface mount technology allows for efficient PCB assembly and space-saving design.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle various power requirements.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuit layouts.

No. of Bits: 8

Having 8 bits allows for versatile input/output configurations.

Power Supplies (V): 2.5/5

Support for multiple power supply voltages enhances compatibility with different systems.

No. of Terminals: 16

The high number of terminals enables connectivity with multiple devices.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style saves space on the PCB and contributes to a compact overall design.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage allows for operation in energy-efficient applications.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this product can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable performance in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance for long-term use.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and connectivity.

Maximum Seated Height: 1.2 mm

The low seated height is suitable for compact electronic designs.

Width: 3.6 mm

The narrow width saves space on the PCB and facilitates dense packing of components.

Maximum Clock Frequency: 0.4 MHz

Support for a high clock frequency enables fast data transfer rates.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates the product's durability during the reflow soldering process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering connections.

Length: 4.4 mm

The compact length contributes to a space-efficient design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures stable performance in harsh operating conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

The versatile general-purpose IO port is suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder joints and ease of assembly.

Maximum Supply Current: 0.175 mA

Low supply current consumption is beneficial for energy-efficient operation.

Nominal Supply Voltage: 5 V

The nominal supply voltage is compatible with standard electronic systems.

Terminal Pitch: 0.4 mm

The fine terminal pitch allows for compact PCB layout and high-density interconnections.

No. of I/O Lines: 8

Having 8 I/O lines provides flexibility in data transfer and connectivity options.

Technical Specifications

Parallel I/O Ports PCA9554ADGVRG4 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

Maximum Clock Frequency:

.4 MHz

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Parallel IO Ports

Maximum Supply Current:

.175 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.6 mm

Peripheral IC Type:

Trade Compliance

PCA9554ADGVRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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