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PCA9555DBG4

Texas Instruments

PCA9555DBG4 by Texas Instruments

PCA9555DBG4 by Texas Instruments is a parallel I/O port with 16 bits. It operates at a supply voltage range of 2.3V to 5.5V and has an industrial temperature grade. This IC is commonly used for general-purpose parallel I/O applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,205 parts In-Stock

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3,205

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Digiode

USA . 2,202 parts In-Stock

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2,202

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Nova Conductors

Japan . 49 parts In-Stock

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49

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 802 parts In-Stock

1+ parts

$6.000

100+ parts

-

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802

$6.000

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AZTECH Wire

Italy . 370 parts In-Stock

1+ parts

$18.855

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370

$18.855

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Semicontronic

India . 758 parts In-Stock

1+ parts

$21.000

100+ parts

$20.475

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$20.370

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758

$21.000

$20.475

$20.370

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One Stop Electronics

USA . 1,647 parts In-Stock

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$32.000

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1,647

$32.000

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Parana Technologies

USA . 177 parts In-Stock

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$44.378

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177

$44.378

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DigiPath Technology Company

USA . 1,031 parts In-Stock

1+ parts

$48.866

100+ parts

$44.956

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1,031

$48.866

$44.956

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ChromeModa Solutions

Germany . 3,004 parts In-Stock

1+ parts

$49.863

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$40.888

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3,004

$49.863

$40.888

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IDEA Electronic Components Group

UK . 1,566 parts In-Stock

1+ parts

$49.863

100+ parts

$47.370

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$44.877

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1,566

$49.863

$47.370

$44.877

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Corohmni

South Africa . 3,097 parts In-Stock

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$84.931

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3,097

$84.931

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Corphita

USA . 3,715 parts In-Stock

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3,715

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Argo Parts USA

USA . 2,422 parts In-Stock

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Bastille Electronics

Australia . 700 parts In-Stock

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700

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Continental Prestige Electronics

USA . 42 parts In-Stock

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42

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Overview

Discover the PCA9555DBG4 by Texas Instruments, a high-quality Parallel I/O Port that offers unparalleled value and advantages to customers. With its small outline and shrink pitch package style, this versatile device allows for easy integration into various applications. Whether you need to expand your GPIO capabilities or control multiple devices simultaneously, the PCA9555DBG4's 16-bit capacity and dual port design have got you covered. Trust in Texas Instruments' reputation for excellence and choose a reliable solution that will exceed your expectations. Embrace efficiency and precision with the PCA9555DBG4!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material ensures durability and lightweight construction, making it suitable for long-lasting use in various applications.

Surface Mount:

YES - This feature allows for easy and efficient PCB assembly, making installation hassle-free and saving valuable time during production.

Maximum Supply Voltage:

5.5 V - The high maximum supply voltage provides versatility and compatibility, allowing the product to operate effectively in a wide range of voltage environments.

Package Shape:

RECTANGULAR - The rectangular shape of the package ensures efficient utilization of space on the circuit board and enables easy integration into various device designs.

No. of Bits:

16 - With 16 bits, this product provides a high level of data processing capability, enabling it to handle complex parallel I/O operations with precision and efficiency.

Power Supplies (V):

2.5/5 - The product supports both 2.5V and 5V power supplies, catering to different system requirements and enhancing compatibility with a wide range of devices.

No. of Terminals:

24 - The ample number of terminals allows for seamless connectivity and expansion possibilities, offering versatility in connecting with other components and peripherals.

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH - This package style ensures a compact form factor while maintaining proper pitch spacing, optimizing PCB layout and enabling space-efficient designs.

Minimum Supply Voltage:

2.3 V - The low minimum supply voltage allows for operation in low-power scenarios, promoting energy efficiency and extending battery life in portable devices.

Maximum Operating Temperature:

85 °C - The high maximum operating temperature ensures reliability and stability even in demanding environments, making it suitable for industrial applications.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature ensures functionality in extremely cold conditions, enhancing the product's suitability for various climate requirements.

Terminal Finish:

NICKEL PALLADIUM GOLD - The use of this terminal finish enhances conductivity, corrosion resistance, and durability, resulting in reliable and long-lasting performance.

Terminal Position:

DUAL - The dual terminal position allows for flexibility in PCB layout and enables efficient routing of signals, contributing to optimal performance and reduced signal interference.

No. of Ports:

2 - With two ports available, this product offers increased connectivity options, allowing for simultaneous data transmission and versatile interfacing capabilities.

Maximum Seated Height:

2 mm - The low maximum seated height facilitates compatibility with slim and compact device designs, enabling space-saving integration without compromising performance.

Width:

5.3 mm - The narrow width of the product promotes efficient space utilization on the PCB, ensuring proper placement and allowing for compact system designs.

Maximum Time At Peak Reflow Temperature (s):

30 - This specification indicates the product's robustness during soldering processes, ensuring it can withstand the necessary thermal conditions without degradation.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature sets a reliable standard for the soldering process, facilitating quick and secure solder joint formation for optimal electrical connections.

Length:

8.2 mm - The compact length of the product contributes to space-saving designs, enabling integration in various applications with space restrictions.

Temperature Grade:

INDUSTRIAL - This product is designed and tested to meet industrial-level temperature requirements, ensuring reliability and performance even in harsh operating conditions.

Peripheral IC Type:

PARALLEL IO PORT, GENERAL PURPOSE - This product serves as a versatile general-purpose Parallel I/O port, providing flexibility and compatibility for a wide range of applications.

Technology:

CMOS - Utilizing CMOS technology, this product offers low power consumption, high noise immunity, and excellent speed-performance ratio, making it ideal for energy-efficient and high-performance applications.

Terminal Form:

GULL WING - The gull wing terminal form facilitates a reliable connection to the PCB, enabling secure soldering and ensuring electrical continuity for superior functionality.

Nominal Supply Voltage:

3 V - The nominal supply voltage of 3V allows for compatibility with many common power sources, simplifying integration and offering convenience in various system designs.

Terminal Pitch:

0.65 mm - The precise terminal pitch of 0.65mm ensures accurate alignment during PCB assembly, enabling reliable connections and efficient signal transfer.

Moisture Sensitivity Level (MSL):

1 - With an MSL rating of 1, this product has a low moisture absorption rate, ensuring its stability and reliability during storage and reflow processes.

No. of I/O Lines:

16 - The 16 I/O lines provide ample connectivity options, facilitating data transfer and enabling versatile interfacing with other peripherals and devices.

Technical Specifications

Parallel I/O Ports PCA9555DBG4 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Parallel IO Ports

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

PCA9555DBG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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